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參數(shù)資料
| 型號： | ICS843AGI-75 |
| 元件分類： | 時鐘產(chǎn)生/分配 |
| 英文描述： | 75 MHz, OTHER CLOCK GENERATOR, PDSO8 |
| 封裝： | 4.40 X 3 MM, 0.925 MM HEIGHT, MO-153, TSSOP-8 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 192K |
| 代理商： | ICS843AGI-75 |
843AGI-75
www.icst.com/products/hiperclocks.html
REV. A NOVEMBER 8, 2005
8
Integrated
Circuit
Systems, Inc.
ICS843I-75
75MHZ, LVCMOS, LVPECL
DUAL OUTPUT OSCILLATOR
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843I-75.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843I-75 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 0.3V = 3.6V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.6V * 91mA = 327.6mW
Power (outputs)
MAX = 30mW/Loaded Output pair
Total Power
_MAX (3.465V, with all outputs switching) = 327.6mW + 30mW = 357.6mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used.
Assuming a moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 6A
below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.358W * 90.5°C/W = 117.4°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
TABLE 6A.THERMAL RESISTANCE
θθθθθ
JA
FOR
8-PIN TSSOP, FORCED CONVECTION
θθθθθ
JA by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
101.7°C/W
90.5°C/W
89.8°C/W
TABLE 6B. THERMAL RESISTANCE
θθθθθ
JA
FOR
8 LEAD SOIC FORCED CONVECTION
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
153.3°C/W
128.5°C/W
115.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
112.7°C/W
103.3°C/W
97.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| ICS843AGI-75LF | 制造商:ICS 制造商全稱:ICS 功能描述:75MHZ, LVCMOS, LVPECL DUAL OUTPUT OSCILLATOR |
| ICS843AGI-75LFT | 制造商:ICS 制造商全稱:ICS 功能描述:75MHZ, LVCMOS, LVPECL DUAL OUTPUT OSCILLATOR |
| ICS843AGI-75T | 制造商:ICS 制造商全稱:ICS 功能描述:75MHZ, LVCMOS, LVPECL DUAL OUTPUT OSCILLATOR |
| ICS843AM-106 | 制造商:ICS 制造商全稱:ICS 功能描述:106.25MHZ, LVCMOS, LVPECL DUAL OUTPUT OSCILLATOR |
| ICS843AM-106LF | 制造商:ICS 制造商全稱:ICS 功能描述:106.25MHZ, LVCMOS, LVPECL DUAL OUTPUT OSCILLATOR |
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