參數(shù)資料
型號(hào): ICS84329BV-01LFT
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 5/21頁
文件大小: 0K
描述: IC SYNTHESIZER 700MHZ 28-PLCC
標(biāo)準(zhǔn)包裝: 500
系列: HiPerClockS™
類型: 頻率合成器
PLL:
輸入: 晶體
輸出: LVPECL
電路數(shù): 1
比率 - 輸入:輸出: 1:1
差分 - 輸入:輸出: 無/是
頻率 - 最大: 700MHz
除法器/乘法器: 是/無
電源電壓: 3.135 V ~ 3.465 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 28-LCC(J 形引線)
供應(yīng)商設(shè)備封裝: 28-PLCC(11.5x11.5)
包裝: 帶卷 (TR)
其它名稱: 84329BV-01LFT
ICS84329B-01
700MHZ, LOW JITTER, CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER
IDT / ICS LVPECL FREQUENCY SYNTHESIZER
13
ICS84329BM-01 REV. C AUGUST, 19, 2013
The following component footprints are used in this layout
example: All the resistors and capacitors are size 0603.
Power and Grounding
Place the decoupling capacitors C1, C2 and C3, as close as
possible to the power pins. If space allows, placement of the
decoupling capacitor on the component side is preferred. This can
reduce unwanted inductance between the decoupling capacitor
and the power pin caused by the via.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power and
ground planes and the component power and ground pins.
The RC filter consisting of R7, C11, and C16 should be placed as
close to the V
CCA pin as possible.
Clock Traces and Termination
Poor signal integrity can degrade the system performance or cause
system failure. In synchronous high-speed digital systems, the
clock signal is less tolerant to poor signal integrity than other
signals. Any ringing on the rising or falling edge or excessive ring
back can cause system failure. The shape of the trace and the
trace delay might be restricted by the available space on the board
and the component location. While routing the traces, the clock
signal traces should be routed first and should be locked prior to
routing other signal traces.
The differential 50
output traces should have the same
length.
Avoid sharp angles on the clock trace. Sharp angle turns
cause the characteristic impedance to change on the
transmission lines.
Keep the clock traces on the same layer. Whenever
possible, avoid placing vias on the clock traces. Placement
of vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
Make sure no other signal traces are routed between the
clock trace pair.
The matching termination resistors should be located as
close to the receiver input pins as possible.
Crystal
The crystal X1 should be located as close as possible to the pins
4 (XTAL_IN) and 5 (XTAL_OUT). The trace length between the X1
and U1 should be kept to a minimum to avoid unwanted parasitic
inductance and capacitance. Other signal traces should not be
routed near the crystal traces.
Figure 7B. PCB Board Layout for ICS84314-02
R7
PIN 2
Signals
Traces
U1
VIA
C2
C11
50 Ohm
Traces
VCCA
X1
VCCA
VCC
C1
PIN 1
C3
GND
C16
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