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參數(shù)資料
| 型號： | ICS843004AGI-01 |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 時鐘產(chǎn)生/分配 |
| 英文描述： | 170 MHz, OTHER CLOCK GENERATOR, PDSO24 |
| 封裝： | 4.40 X 7.80 MM, 0.92 MM HEIGHT, MO-153, TSSOP-24 |
| 文件頁數(shù)： | 2/14頁 |
| 文件大?。?/td> | 249K |
| 代理商： | ICS843004AGI-01 |
843004AGI-01
www.icst.com/products/hiperclocks.html
REV. A FEBRUARY 11, 2005
10
Integrated
Circuit
Systems, Inc.
ICS843004I-01
FEMTOCLOCKSCRYSTAL-TO-
3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843004I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843004I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 130mA = 450.45mW
Power (outputs)
MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 30mW = 120mW
Total Power
_MAX (3.465V, with all outputs switching) = 450.45mW + 120mW = 570.45mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 65°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.571W * 65°C/W = 122.1°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
24-PIN TSSOP, FORCED CONVECTION
θθθθθ
JA by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65°C/W
62°C/W
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相關(guān)代理商/技術(shù)參數(shù) |
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| ICS843004AGI-01LF | 功能描述:IC SYNTHESIZER LVPECL 24-TSSOP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標準包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS843004AGI-01LFT | 功能描述:IC SYNTHESIZER LVPECL 24-TSSOP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標準包裝:1,000 系列:- 類型:時鐘/頻率合成器，扇出分配 PLL:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 除法器/乘法器:- 電源電壓:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:56-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-VFQFP-EP（8x8） 包裝:帶卷 (TR) 其它名稱:844S012AKI-01LFT |
| ICS843004AGI-01T | 制造商:Integrated Device Technology Inc 功能描述:IC SYNTHESIZER LVPECL 24TSSOP |
| ICS843004AGI-02LF | 功能描述:IC SYNTHESIZER LVPECL 24-TSSOP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標準包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS843004AGI-02LFT | 功能描述:IC SYNTHESIZER LVPECL 24-TSSOP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標準包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
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