參數(shù)資料
型號: ICS83052AGILF
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 4/17頁
文件大小: 0K
描述: IC CLOCK MUX 2:1 250MHZ 8-TSSOP
標(biāo)準(zhǔn)包裝: 96
系列: HiPerClockS™
類型: 多路復(fù)用器
電路數(shù): 1
比率 - 輸入:輸出: 2:1
差分 - 輸入:輸出: 無/無
輸入: LVCMOS,LVTTL
輸出: LVCMOS,LVTTL
頻率 - 最大: 250MHz
電源電壓: 2.375 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 8-TSSOP
包裝: 管件
其它名稱: 800-1106
800-1106-5
800-1106-ND
83052AGILF
ICS83052I REVISION B DECEMBER 8, 2011
12
2011 Integrated Device Technology, Inc.
ICS83052I Data Sheet
2:1, SINGLE ENDED MULTIPLEXER
2. Junction Temperature
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of
the device. The maximum recommended junction temperature is 125°C. Limiting the internal transistor junction, TJ, to
125°C ensures that the bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used.
Assuming no air flow and a multi-layer board, the appropriate value is 101.7°C/W per Table 6.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.221W * 101.7°C/W = 107.4°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (multi-layer).
TABLE 6.
θ
JA
VS
. AIR FLOW TABLE FOR 8 LEAD TSSOP
θθθθθ
A
J
y
t
i
c
o
l
e
V
Y
B
d
n
o
c
e
S
r
e
p
s
r
e
t
e
M
01
5
.
2
s
d
r
a
o
B
t
s
e
T
d
r
a
d
n
a
t
S
C
E
D
E
J
,
B
C
P
r
e
y
a
L
-i
tl
u
MW
/
C
°
7
.
1
0
1W
/
C
°
5
.
0
9W
/
C
°
8
.
9
8
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