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參數(shù)資料
| 型號： | ICS813001AGIL |
| 英文描述： | DUAL VCXO W/3.3V, 2.5V LVPECL FEMTOCLOCK-TM PLL |
| 中文描述： | 雙壓控W/3.3V，2.5伏的LVPECL FEMTOCLOCK，商標(biāo)鎖相環(huán) |
| 文件頁數(shù)： | 14/18頁 |
| 文件大?。?/td> | 237K |
| 代理商： | ICS813001AGIL |
813001AGI
www.icst.com/products/hiperclocks.html
REV. A SEPTEMBER 2, 2005
14
Integrated
Circuit
Systems, Inc.
ICS813001I
D
UAL
VCXO
W
/3.3V, 2.5V LVPECL
F
EMTO
C
LOCK
PLL
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS813001I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS813001I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE:
Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 130mA =
450.45mW
Power (outputs)
MAX
=
30mW/Loaded Output pair
Total Power
_MAX
(3.465V, with output switching) =
450.45mW + 30mW =
480.5mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 70°C/W per Table 8 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.481W * 65°C/W = 116.3°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
ABLE
8. T
HERMAL
R
ESISTANCE
θ
JA
FOR
24-
PIN
TSSOP, F
ORCED
C
ONVECTION
θ
JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65°C/W
62°C/W
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| ICS813001AGILF | 功能描述:IC VCXO DUAL MULTIPLER 24-TSSOP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS813001AGILFT | 功能描述:IC VCXO DUAL MULTIPLER 24-TSSOP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS813001AGIT | 制造商:ICS 制造商全稱:ICS 功能描述:DUAL VCXO W/3.3V, 2.5V LVPECL FEMTOCLOCK-TM PLL |
| ICS813001I | 制造商:ICS 制造商全稱:ICS 功能描述:DUAL VCXO W/3.3V, 2.5V LVPECL FEMTOCLOCK-TM PLL |
| ICS813076BYI-31LF | 功能描述:IC VCXO-PLL WIRELESS 48-TQFP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器，PLL，頻率合成器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
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