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3
FN3158.7
April 17, 2006
Absolute Maximum Ratings
Thermal Information
Supply Voltage (V
DD
- V
SS
) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
Input Voltage (Any Terminal) (Note 1). . .V
SS
- 0.3V to V
DD
, + 0.3V
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Thermal Resistance (Typical, Note 2)
PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . .150°C
Maximum Storage Temperature Range . . . . . . . . .-65×°C to 150°C
Maximum Lead Temperature (Soldering, 10s) . . . . . . . . . . . .300°C
θ
JA
(°C/W)
60
70
*Pb-free PDIPs can be used for through hole wave solder process-
ing only. They are not intended for use in Reflow solder processing
applications.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Due to the SCR structure inherent in the CMOS process, connecting any terminal to voltages greater than V
DD
or less than V
SS
may cause
destructive device latchup. For this reason, it is recommended that no inputs from external sources not operating on the same power supply be
applied to the device before its supply is established, and that in multiple supply systems, the supply to the ICM7211AM be turned on first.
2.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
CHARACTERISTICS
V
DD
= 5V
±
10%, T
A
= 25°C, V
SS
= 0V Unless Otherwise Specified
Operating Supply Voltage Range (V
DD
- V
SS
), V
SUPPLY
Operating Current, I
DD
Oscillator Input Current, I
OSCI
Segment Rise/Fall Time, t
r
, t
f
Backplane Rise/Fall Time, t
r
, t
f
Oscillator Frequency, f
OSC
Backplane Frequency, f
BP
3
5
6
V
Test circuit, Display blank
-
10
50
μ
A
Pin 36
-
±
2
±
10
μ
A
C
L
= 200pF
C
L
= 5000pF
Pin 36 Floating
-
0.5
-
μ
s
-
1.5
-
μ
s
-
19
-
kHz
Pin 36 Floating
-
150
-
Hz
INPUT CHARACTERISTICS
Logical “1” Input Voltage, V
IH
Logical “0” Input Voltage, V
IL
Input Leakage Current, I
ILK
Input Capacitance, C
lN
BP/Brightness Input Leakage, I
BPLK
BP/Brightness Input Capacitance, C
BPI
4
-
-
V
-
-
1
V
Pins 27-34
-
±
0.01
±
1
μ
A
Pins 27-34
-
5
-
pF
Measured at Pin 5 with Pin 36 at V
SS
All Devices
-
±
0.01
±
1
μ
A
-
200
-
pF
AC CHARACTERISTICS
Chip Select Active Pulse Width, t
WL
Other Chip Select Either Held Active, or
Both Driven Together
200
-
-
ns
Data Setup Time, t
DS
Data Hold Time, t
DH
Inter-Chip Select Time, t
ICS
100
-
-
ns
10
0
-
ns
2
-
-
μ
s
ICM7211AM