參數(shù)資料
型號(hào): ICL7612DCPAZ
廠商: Intersil
文件頁數(shù): 4/13頁
文件大?。?/td> 0K
描述: IC OPAMP 1.4MHZ CMOS LP 8-DIP
標(biāo)準(zhǔn)包裝: 50
放大器類型: 通用
電路數(shù): 1
轉(zhuǎn)換速率: 1.6 V/µs
增益帶寬積: 1.4MHz
電流 - 輸入偏壓: 1pA
電壓 - 輸入偏移: 15000µV
電流 - 電源: 1mA
電流 - 輸出 / 通道: 40mA
電壓 - 電源,單路/雙路(±): 2 V ~ 16 V,±1 V ~ 8 V
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 8-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 8-PDIP
包裝: 管件
12
FN2919.9
April 26, 2007
ICL7611, ICL7612
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N8
8
7
α
-
Rev. 1 6/05
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