參數(shù)資料
型號(hào): ICL3225
廠商: Intersil Corporation
英文描述: 1 Microamp, +3V to +5.5V, 1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown(具有自動(dòng)斷電功能的1μA, +3V到+5.5V, 1Mbps, RS-232收發(fā)器)
中文描述: 1微安,3V至5.5V,1Mbps的,RS - 232接口的增強(qiáng)型自動(dòng)掉電(具有自動(dòng)斷電功能的1μA的,采用3V到5.5V之間,1Mbps的,RS - 232接口收發(fā)器收發(fā)器)
文件頁(yè)數(shù): 16/18頁(yè)
文件大?。?/td> 382K
代理商: ICL3225
16
FN4878.8
February 27, 2006
ICL3225, ICL3245
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
α
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
M20.209
(JEDEC MO-150-AE ISSUE B)
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.068
0.078
1.73
1.99
A1
0.002
0.008’
0.05
0.21
A2
0.066
0.070’
1.68
1.78
B
0.010’
0.015
0.25
0.38
9
C
0.004
0.008
0.09
0.20’
D
0.278
0.289
7.07
7.33
3
E
0.205
0.212
5.20’
5.38
4
e
0.026 BSC
0.65 BSC
H
0.301
0.311
7.65
7.90’
L
0.025
0.037
0.63
0.95
6
N
α
20
20
7
0 deg.
8 deg.
0 deg.
8 deg.
Rev. 3 11/02
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