參數(shù)資料
型號: IBM25PPC750L-GB500CA2T
英文描述: Microprocessor
中文描述: 微處理器
文件頁數(shù): 37/50頁
文件大小: 516K
代理商: IBM25PPC750L-GB500CA2T
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page 33
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Mechanical Dimensions of the 360 CBGA Package
Figure 16 provides the mechanical dimensions and bottom surface nomenclature of the 360 CBGA package.
Figure 16. Mechanical Dimensions and Bottom Surface Nomenclature of the 360 CBGA Package
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING FROM
THE ARRAY.
2.
3.
MILLIMETERS
Minimum
2.65
0.80
1.10
0.82
25.00 BSC
5.443
2.48
DIM
A
A1
A2
b
D
D1
D2
D3
e
E
E1
E2
E3
Maximum
3.20
1.00
1.30
0.93
6.3
1.27 BSC
25.00 BSC
8.075
2.48
7.43
e
19 18 17 16 15 14 13 12 11 10 9
8
7
6
5
4 3 2
1
U
V
W
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B
C
C
360X
A
0.3
0.15
b
A
A1
A2
C
0.15 C
Not To Scale
(18x)
(18x)
0.2
D
2X
E
E1
D1
0.2
2X
B
A
A01 Corner Locator
A01 Corner
CHIP
D2
D3
D2
D3
E3
E2
E3
E2
CAPACITOR
Note: All caps on the SCM are lower in height than the processor die.
Top View
There is no ball in the A01 position
A01 Corner
X-ray view of balls
from top of package
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