參數(shù)資料
型號: IBM25PPC750L-GB366A2R
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 366 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù): 24/48頁
文件大?。?/td> 608K
代理商: IBM25PPC750L-GB366A2R
Page 30
Version 1.02
12/8/99
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
PowerPC 750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 750 ceramic ball grid array 360 CBGA
packages.
Figure 15 (in part A) shows the pinout of the 360 CBGA package as viewed from the top surface. Part B
shows the side profile of the 360 CBGA package to indicate the direction of the top surface view.
Figure 15. Pinout of the 750 360 CBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
17 18 19
U
V
W
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