參數(shù)資料
型號(hào): IBM25PPC750L-GB350A2SR
英文描述: Microprocessor
中文描述: 微處理器
文件頁(yè)數(shù): 26/50頁(yè)
文件大小: 516K
代理商: IBM25PPC750L-GB350A2SR
Page 22
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
PowerPC 740 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PowerPC 740, a 255 pin ceramic ball grid array
(BGA) package.
Figure 13 (in part A) shows the pinout of the 255 CBGA package as viewed from the top surface. Part B
shows the side profile of the 255 CBGA package to indicate the direction of the top surface view.
Figure 13. Pinout of the PowerPC 740 BGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate Assembly.
Encapsulation
View
Part B
Die
Part A
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