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參數(shù)資料
| 型號(hào)： | IBM25PPC750L-GB350A2R |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 36/48頁 |
| 文件大?。?/td> | 608K |
| 代理商： | IBM25PPC750L-GB350A2R |
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12/8/99
Version 1.02
Page 41
PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20
m Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
The board designer can choose between several types of heat sinks to place on the 750. There are several
commercially-available heat sinks for the 750 provided by the following vendors:
Chip Coolers, Inc.
800-227-0254 (USA/Canada)
333 Strawberry Field Rd.
401-739-7600
Warwick, RI 02887-6979
Thermalloy
214-243-4321
2021 W. Valley View Lane
P.O. Box 810839
Dallas, TX 75731
International Electronic Research Corporation (IERC)
818-842-7277
135 W. Magnolia Blvd.
Burbank, CA 91502
Aavid Engineering
603-528-3400
One Kool Path
Laconic, NH 03247-0440
Wakefield Engineering
617-245-5900
60 Audubon Rd.
Wakefield, MA 01880
Ultimately, the final selection of an appropriate heat sink for the 750 depends on many factors, such as ther-
mal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table “Package Thermal Characteristics1,” on page 10,
the intrinsic conduction thermal resistance paths are as follows.
Die junction-to-case thermal resistance
Die junction-to-ball thermal resistance
Figure 21 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25PPC750L-GB350A2SR | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| IBM25PPC750L-GB350A2ST | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| IBM25PPC750L-GB350A2T | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|CERAMIC |
| IBM25PPC750L-GB350C2R | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| IBM25PPC750L-GB350C2SR | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
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