參數(shù)資料
型號： IBM25PPC750L-GB300C2R
英文描述： Microprocessor
中文描述： 微處理器
文件頁數(shù)： 43/50頁
文件大?。?/td> 516K
代理商： IBM25PPC750L-GB300C2R
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page 39
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Thermal Management Information
This section provides thermal management information for the CBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package, and
mounting clip and screw assembly, see Figure 20.
Figure 20. Package Exploded Cross-Sectional View with Several Heat Sink Options
Maximum Heatsink Weight Limit for the 360 CBGA
Force
Maximum (pounds)
Dynamic Compression
10.0
Dynamic Tensile
2.5
Static Constant (Spring Force)
8.2
CBGA Package
Heat Sink
Heat Sink clip
Adhesive
or
Thermal
Interface
Material
Printed
Circuit
Board
Option
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IBM25PPC750L-GB300C2SR 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor
IBM25PPC750L-GB300C2ST 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor
IBM25PPC750L-GB300C2T 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor
IBM25PPC750L-GB300D2R 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor
IBM25PPC750L-GB300D2SR 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor
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