參數(shù)資料
型號(hào)： IBM25PPC750L-FB0C350W
英文描述： 255 POS POP-TOP SOCK/ADPT
中文描述： 32位微處理器
文件頁數(shù)： 47/50頁
文件大?。?/td> 516K
代理商： IBM25PPC750L-FB0C350W
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page 43
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
617-935-4850
Thermagon, Inc.
3256 West 25th Street
Cleveland, OH 44109-1668
216-741-7659
Loctite Corporation
1001 Trout Brook Crossing
Rocky Hill, CT 06067
860-571-5100
AI Technology (e.g. EG7655)
1425 Lower Ferry Road
Trent, NJ 08618
609-882-2332
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows.
T
J
= T
A
+ T
R
+ (
θ
JC
+
θ
INT
+
θ
SA
)
×
P
D
Where
:
T
J
is the die-junction temperature
T
A
is the inlet cabinet ambient temperature
T
R
is the air temperature rise within the system cabinet
θ
JC
is the junction-to-case thermal resistance
θ
INT
is the thermal resistance of the thermal interface material
θ
SA
is the heat sink-to-ambient thermal resistance
P
D
is the power dissipated by the device
Typical die-junction temperatures (T
) should be maintained less than the value specified in Table “Package
Thermal Characteristics1,” on page 8. The temperature of the air cooling the component greatly depends
upon the ambient inlet air temperature and the air temperature rise within the computer cabinet. An electronic
cabinet inlet-air temperature (T
A
) may range from 30 to 40
°
C. The air temperature rise within a cabinet (T
R
)
may be in the range of 5 to 10
°
C. The thermal resistance of the interface material (
θ
) is typically about 1
°
C/
W. Assuming a T
of 30
°
C, a T
of 5
°
C, a CBGA package
θ
JC
= 0.03, and a power dissipation (P
D
) of 5.0 watts,
the following expression for T
J
is obtained.
Die-junction temperature: T
J
= 30
°
C + 5
°
C + (0.03
°
C/W +1.0
°
C/W +
θ
SA
)
×
5W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
SA
) versus air flow velocity
is shown in Figure 23.
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