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參數(shù)資料
| 型號： | IBM25PPC750L-FB0B350W |
| 元件分類： | 32位微控制器 |
| 英文描述： | 32-Bit Microprocessor |
| 中文描述： | 32位微處理器 |
| 文件頁數(shù)： | 12/50頁 |
| 文件大?。?/td> | 516K |
| 代理商： | IBM25PPC750L-FB0B350W |
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Page 8
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
5/20/99
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
The 750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-ana-
log converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the 750 PPC
Microprocessor User’s Manual for more information on the use of this feature. Specifications for the thermal
sensor portion of the TAU are found in the table below.
.
Package Thermal Characteristics
1
Characteristic
Symbol
740
750
Unit
Thermal resistance, junction-to-case (top sur-
face of die) typical
θ
JC
0.03
0.03
°
C/W
Thermal resistance, junction-to-balls, typical
θ
JB
3.8 - 7.1
2
3.8 - 7.6
2
°
C/W
Thermal resistance, junction-to-ambient, at air-
flow, no heat sink, typical
50 FPM
16.0
15.1
°
C/W
100 FPM
15.4
16.4
°
C/W
150 FPM
14.9
14.2
°
C/W
200 FPM
14.4
13.7
°
C/W
Package Size
21 x 21
25 x 25
mm
2
Die Size
5.12 x 7.78
5.12 x 7.78
mm
2
Note:
1. Refer to Section “Thermal Management Information,” on page 39 for more information about thermal management.
2. 3.8
°
C/W is theoretical
θ
mounted to infinite heat sink. The larger number applies to module mounted to a 1.8 mm thick, 2P card using 1 oz. copper
power/gnd planes, with effective area for heat transfer of 75mm x 75mm.
Thermal Sensor Specifications
See Table “Recommended Operating Conditions,” on page 7, for operating conditions.
Num
Characteristic
Minimum
Maximum
Unit
Notes
1
Temperature range
0
128
°
C
1
2
Comparator settling time
20
—
ms
2
3
Resolution
4
—
°
C
3
4
Drift, all sources
—
.25
LSb
5
Linearity, error over range
—
1
LSb
6
Offset error, reducible
—
2
LSb
Note:
1. The temperature is the junction temperature of the die. The thermal assist unit's (TAU) raw output does not indicate an absolute temperature, but it
must be interpreted by software to derive the absolute junction temperature. For information on how to use and calibrate the TAU, contact your local
IBM sales office. This specification reflects the temperature span supported by the design.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR.
3. This value is guaranteed by design and is not tested.
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