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Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
750GX_ds_body.fm SA14-2765-02
September 2, 2005
Electrical and Thermal Characteristics
3.2 AC Electrical Characteristics
This section provides the AC electrical characteristics for the 750GX. After fabrication, parts are sorted by
tested for conformance to the AC specifications for that frequency. The processor core frequency is deter-
mined by the bus (SYSCLK) frequency and the settings of the PLL configuration (PLL_CFG[0-4]) signals.
Table 3-5. Power Consumption for DD1.1
Mode
Tj
Processor Frequency
Unit
Notes
733 MHz
800 MHz
933 MHz
1.0 GHz
Core Voltage
—
1.45
1.5
V
Maximum Power
105°C
9.5
9.75
12.5
14.0
W
Typical Power
65°C
4.90
5.0
7.35
8.3
W
Nap Power, Maximum
50°C
4.3
5.2
6.3
W
Sleep Power, Maximum
50°C
4.3
5.2
6.0
W
Notes:
1. These values apply for all valid 60× buses. The values do not include I/O supply power (OVDD) or PLL supply power (AVDD). OVDD
power is system dependent, but is typically less than 2% of VDD power.
2. Maximum power is measured at the indicated VDD and TJ using parts with worst-case process parameters and running RC5-72.
RC5-72 runs hotter than typical production code, but it is possible to design code that runs even hotter than RC5-72. See Reducing
PowerPC 750GX Power Dissipation Application Note for more information.
3. Typical power is an estimate of the average value modeled in a system executing typical applications with VDD and typical process
parameters. Note that typical power cannot be used in the design of the power supply or cooling system.
Table 3-6. Power Consumption for DD1.2
Mode
Tj
Processor Frequency
Unit
Notes
800 MHz
Standard
933 MHz
Low Power
933 MHz
Standard
1.0 GHz
Low Power
1.0 GHz
Standard
Core Voltage
—
1.45
1.5
V
Maximum Power
105°C
11.5
10.75
13.75
11
14
W
Typical Power
65°C
6.5
8.0
6.75
8.3
W
Nap Power, Maximum
50°C
5.2
4.5
6.2
4.5
6.3
W
Sleep Power, Maximum
50°C
5.2
4.3
6.0
4.3
6.0
W
Notes:
1. These values apply for all valid 60× buses. The values do not include I/O supply power (OVDD) or PLL supply power (AVDD).
OVDD power is system dependent, but is typically less than 2% of VDD power.
2. Maximum power is measured at the indicated VDD and TJ using parts with worst-case process parameters and running RC5-72.
RC5-72 runs hotter than typical production code, but it is possible to design code that runs even hotter than RC5-72. See Pow-
erPC 750GX Power Dissipation Application Note for more information.
3. Typical power is an estimate of the average value modeled in a system executing typical applications with VDD and typical process
parameters. Note that typical power cannot be used in the design of the power supply or cooling system.