- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄67683 > IBM25PPC750GXEBB6H42T 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292 PDF資料下載
參數(shù)資料
| 型號(hào)： | IBM25PPC750GXEBB6H42T |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292 |
| 封裝： | 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292 |
| 文件頁(yè)數(shù)： | 64/74頁(yè) |
| 文件大?。?/td> | 1054K |
| 代理商： | IBM25PPC750GXEBB6H42T |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)當(dāng)前第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)
Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
750GX_ds_body.fm SA14-2765-02
September 2, 2005
System Design Information
Page 67 of 73
The board designer can choose between several types of thermal interfaces. Heat-sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Section 5.8 provides a heat-sink selection example using one of the commercially available heat sinks.
5.8 Heat-Sink Selection Example
For preliminary heat-sink sizing, the die-junction temperature can be expressed as follows:
T
J = TA + TR + (
θ
JC +
θ
INT +
θ
SA)
× P
D
where:
T
J is the die-junction temperature
T
A is the inlet cabinet ambient temperature
T
R is the air temperature rise within the system cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the thermal resistance of the thermal interface material
θ
SA is the heat-sink-to-ambient thermal resistance
P
D is the power dissipated by the device
Table 5-9. 750GX Thermal Interface and Adhesive Materials Vendors
Company Names and Addresses for Thermal Interfaces and Adhesive Materials Vendors
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
(989) 496-4000
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
(781) 935-4850
Thermagon, Inc.
4797 Detroit Avenue
Cleveland, OH 44102-2216
(216) 939-2300 / (888) 246-9050
Loctite Corporation
1001 Trout Brook Crossing
Rocky Hill, CT 06067
(860) 571-5100 / (800) 562-8483
AI Technology
70 Washington Road
Princeton, NJ 08550-1097
(609) 799-9388
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IBM25PPC750GXEBR2H33T | 32-BIT, 800 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750GXECB5H43T | 32-BIT, 933 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750GXECR5H83T | 32-BIT, 933 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750GXECR6H82T | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA292 |
| IBM25PPC750GXEBB5082T | 32-BIT, 933 MHz, RISC PROCESSOR, CBGA292 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IBM25PPC750GXECB2563T | 制造商:IBM 功能描述: |
| IBM25PPC750GXECB2H33T | 制造商:IBM 功能描述: |
| IBM25PPC750GXECB5H42V | 制造商:IBM 功能描述:POLARIS 1.2 ? 21CBGA GRE2 ? HALFMODE 933MH - Trays |
| IBM25PPC750GXECB5H82T | 制造商:IBM 功能描述:POLARIS 1.2 ? 21CBGA GRE2 LP HALFMODE 933 - Trays |
| IBM25PPC750GXECB5H82V | 制造商:IBM 功能描述:POLARIS 1.2 ? 21CBGA GRE2 LP HALFMODE 933 - Trays |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。