參數(shù)資料
型號(hào)： IBM25PPC750GXEAR2532T
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 800 MHz, RISC PROCESSOR, CBGA292
封裝： 21 X 21 MM, 1 MM PITCH, LEAD FREE, CERAMIC, BGA-292
文件頁數(shù)： 64/74頁
文件大?。?/td> 1054K
代理商： IBM25PPC750GXEAR2532T
Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
750GX_ds_body.fm SA14-2765-02
September 2, 2005
System Design Information
Page 67 of 73
The board designer can choose between several types of thermal interfaces. Heat-sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Section 5.8 provides a heat-sink selection example using one of the commercially available heat sinks.
5.8 Heat-Sink Selection Example
For preliminary heat-sink sizing, the die-junction temperature can be expressed as follows:
T
J = TA + TR + (
θ
JC +
θ
INT +
θ
SA)
× P
D
where:
T
J is the die-junction temperature
T
A is the inlet cabinet ambient temperature
T
R is the air temperature rise within the system cabinet
θ
JC is the junction-to-case thermal resistance
θ
INT is the thermal resistance of the thermal interface material
θ
SA is the heat-sink-to-ambient thermal resistance
P
D is the power dissipated by the device
Table 5-9. 750GX Thermal Interface and Adhesive Materials Vendors
Company Names and Addresses for Thermal Interfaces and Adhesive Materials Vendors
Dow-Corning Corporation
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
(989) 496-4000
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4850
(781) 935-4850
Thermagon, Inc.
4797 Detroit Avenue
Cleveland, OH 44102-2216
(216) 939-2300 / (888) 246-9050
Loctite Corporation
1001 Trout Brook Crossing
Rocky Hill, CT 06067
(860) 571-5100 / (800) 562-8483
AI Technology
70 Washington Road
Princeton, NJ 08550-1097
(609) 799-9388
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