參數(shù)資料
型號(hào)： IBM25PPC750GXEAB2H32T
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, 800 MHz, RISC PROCESSOR, CBGA292
封裝： 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
文件頁(yè)數(shù)： 8/74頁(yè)
文件大?。?/td> 1054K
代理商： IBM25PPC750GXEAB2H32T
Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
Electrical and Thermal Characteristics
Page 16 of 73
750GX_ds_body.fm SA14-2765-02
September 2, 2005
Table 3-3. Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
θ
JC
0.1
°C/W
CBGA package thermal resistance, junction-to-lead thermal resistance (typical)
θ
JB
7.6
°C/W
Note:
θ
JC
is the internal resistance from the junction to the back of the die. A heat sink customized to the end user application and
ambient operating environment is required to ensure the die junction temperature is maintained within the limits defined in Table 3-2 on
page 15. For more information about thermal management, see Section 5.7 on page 61.
Table 3-4. DC Electrical Specifications
See Table 3-2 on page 15 for recommended operating conditions.
Characteristic
Symbol
Voltage
Unit
Notes
Min.
Max.
Input high voltage (all inputs except system clock [SYSCLK])
VIH (1.8 V)
1.20
—
V
VIH (2.5 V)
1.70
—
V
VIH (3.3 V)
2.4
—
V
Input low voltage (all inputs except SYSCLK)
VIL (1.8 V)
—0.60
V
VIL (2.5 V)
—0.70
V
VIL (3.3 V)
—0.80
V
SYSCLK input high voltage
CVIH (1.8 V)
1.20
—
V
CVIH (2.5 V)
1.90
—
V
CVIH (3.3 V)
2.1
—
V
SYSCLK input low voltage
CVIL (1.8 V, 2.5 V,
3.3 V)
—0.40
V
Input leakage current, VIN = applies to all OVDD levels
IIN
—
300
Hi-Z (off state) leakage current, VIN = applies to all OVDD levels
ITSI
—20
Output high voltage, IOH = -4 mA
VOH (1.8 V)
1.30
—
V
VOH (2.5 V)
2.00
—
V
VOH (3.3 V)
2.40
—
V
Output low voltage, IOL = 4 mA
VOL (1.8 V, 2.5 V,
3.3 V)
—0.4
V
Capacitance, VIN = 0 V, f = 1 MHz
CIN
—7
pF
Notes:
1. Capacitance values are guaranteed by design and characterization, and are not tested.
2. Additional input current may be attributed to the Level Protection Keeper Lock circuitry. For details, see Section 5.9, Operational
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