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參數(shù)資料
| 型號： | IBM25PPC750GXEAB1033T |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 733 MHz, RISC PROCESSOR, CBGA292 |
| 封裝： | 21 X 21 MM, 1 MM PITCH, LEAD FREE, CERAMIC, BGA-292 |
| 文件頁數(shù)： | 71/74頁 |
| 文件大?。?/td> | 1054K |
| 代理商： | IBM25PPC750GXEAB1033T |
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Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
750GX_ds_revlog.fm SA14-2765-02
September 2, 2005
Revision Log
Page 73 of 73
Revision Log
Date
Description
January 8, 2003
Initial advance release (version 0.1).
March 29, 2004
First general release (version 1.0).
December 27, 2004
Version 1.1
Added DD2.1 info to Table 1-1. 750GX Processor Version Register (PVR)
In Section 1.4 Part Number Information, added "C=DD1.2" in the Design Revision Level entry.
In Section 1.4 Part Number Information, changed information for 8.
In Section 1.4 Part Number Information, added 2 notes.
February 17, 2005
Version SA14-2765-00
Changed document number to SA14-2765-00.
Changed notes to Table 3-1 Absolute Maximum Ratings.
Changed Table 3-5 Power Consumption for DD1.1.
Added new Table 3-6 Power Consumption for DD1.2
Changed Table 3-8 (old 3-7) 60x Bus Input AC Timing Specifications.
Changed Table 5-7 Maximum Heat-Sink Weight Limit for the CBGA.
Removed “Preliminary“ from document status.
August 8, 2005
Version SA14-2765-01
Changed Section 1.4 Part Number Information.
Changed Table 3-2. Recommended Operating Conditions.
Changed Table 3-4. DC Electrical Specifications.
Changed Table 3-8. 60x Bus Input AC Timing Specifications.
Changed Figure 4-1. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package for DD1.0
to Figure 4-1. Mechanical Dimensions, Standard Package.
Changed Figure 4-2. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package for DD1.1
to Figure 4-1. Mechanical Dimensions, ROHS-Compatible Package.
September 2, 2005
Version SA14-2765-02
Removed “Preliminary“ from document headers. Also removed statements about preliminary information from the
legal statements.
Changed Section 4 Dimensions and Signal assignments by removing second and third paragraphs and
Table 4-1 List of Drawings with IBM Package Numbers.
Changed Table 4-1. Standard and Reduced-Lead Package, Layout, and Assembly Differences.
Changed Figure 4-1. Mechanical Dimensions, Standard Package.
Changed Figure 4-1. Mechanical Dimensions, ROHS-Compatible Package.
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