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參數(shù)資料
| 型號： | IAM-91563-BLK |
| 英文描述： | 0.8-6 GHz 3V Downconverter |
| 中文描述： | 0.8-6 GHz的3V的變頻器 |
| 文件頁數(shù)： | 13/16頁 |
| 文件大小： | 198K |
| 代理商： | IAM-91563-BLK |
7-147
SOT-363 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-363 (SC-70)
package used by the IAM-91563 is
shown in Figure 35 (dimensions
are in inches). This layout pro-
vides ample allowance for pack-
age placement by automated
assembly equipment without
adding parasitics that could
impair the high frequency RF
performance of the IAM-91563.
The layout is shown with a
nominal SOT-363 package foot-
print superimposed on the PCB
pads.
0.026
0.035
0.075
0.016
Figure 35. PCB Pad Layout
(dimensions in inches).
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-363
package, will reach solder reflow
temperatures faster than those
with a greater mass.
The IAM-91563 is has been
qualified to the time-temperature
profile shown in Figure 36. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
MAX
) should not
exceed 235
°
C.
These parameters are typical for a
surface mount assembly process
for the IAM-91563. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
TIME (seconds)
T
MAX
T
°
C
0
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120
180
240
300
Figure 36. Surface Mount Assembly Profile.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IAM-91563-TR1 | IAM91563 |
| IAM-91563 | 0.8-6 GHz 3V Downconverter(0.8-6 GHz 3V，下變頻器) |
| IAM-92516 | High Linearity GaAs FET Mixer |
| IAM-92516-BLK | High Linearity GaAs FET Mixer |
| IAM-92516-TR1 | High Linearity GaAs FET Mixer |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IAM-91563-BLKG | 功能描述:上下轉(zhuǎn)換器 3 SV 9 dB RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128 |
| IAM-91563-TR1 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:0.8-6 GHz 3V Downconverter |
| IAM-91563-TR1G | 功能描述:上下轉(zhuǎn)換器 3 SV 9 dB RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128 |
| IAM-91563-TR2G | 功能描述:上下轉(zhuǎn)換器 3 SV 9 dB RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128 |
| IAM-92516 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:High Linearity GaAs FET Mixer |
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