
Features: Benefits:
32 independent high voltage amplifiers
Saves board space.
Output voltage up to 295V
Provides adequate movement for an optical MEMS switch
2.0V/
μ
s output slew rate
Provides adequate switching time from one line to another
Integrated feedback resistors
Saves board space. Reduces component count and
simplifies board layout.
High value internal feedback resistors
Minimizes power consumption and dissipation
Very low operating current
(maximum 25
μ
A per channel)
Minimizes power consumption and dissipation
Integrated silicon diode for temperature
sensing
Allows for external temperature compensation or thermal
protection
Adjustable output current limit
Provides output short circuit protection to ground and
supply rails
Applications
- MEMS Driver
(MicroElectroMechanical
Systems)
- Piezoelectric Transducer
Driver
- Optical Crosspoint Switches
(using MEMS technology)
Product
Summary
Sheet
HV256
32-Channel High Voltage Amplifier Array
11/20/02
Product Overview:
The HV256 is a 32-channel high voltage amplifier
array integrated circuit featuring programmable,
external current limit on each amplifier. Each
channel is configured as a noninverting amplifier.
The maximum output voltage swing is 5V below
the V
high voltage supply. The outputs can
drive capacitive loads of up to 3000pF. Typical
slew rate under a no load condition is 2.0V/μs.
The amplifier has an internal closed loop gain of
37dB or 72V/V saving the user from having to
use external gain setting resistors. When a DAC
voltage of 4.096 is applied to the input of an
amplifier an output voltage of 295V will be cre-
ated.
The HV256 operates on a 300V supply and two
low voltage supplies, 8.0V and -7.0V. It is de-
signed to operate on minimal power featuring a
low quiescent current, while still maintaining a
slew rate of 2.0V/μs. To further reduce power
consumption, high value gain setting resistors
are used for the internal feedback path. The
output current for all 32 channels can be ad-
justed via two external resistors. This allows the
user to set the amount of output current during a
shorted condition. An integrated diode is also
included to help monitor die temperature.
Block Diagram
Package Type:
Low Profile MQFP Gullwing
(FG)
Also available in die form
HV
OUT
0
HV
OUT
31
HV
OUT
1
GND
V
PP
V
NN
-
+
R
71R
V
DD
V
PP
-
+
V
IN
0
V
PP
-
+
Output Current Source
Limiting for all HV
OUT
R
SOURCE
R
R
R
SINK
Output Current Sink
Limiting for all HV
OUT
71R
71R
Anode
Cathode
To internal V
PP
bus
B
YP
-V
PP
B
YP
-V
DD
B
YP
-V
NN
To internal V
NN
bus
To internal V
DD
bus
V
IN
1
V
IN
31
V
DD
V
DD
V
NN
V
NN