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參數(shù)資料
| 型號(hào)： | HSP45240 |
| 廠商： | Intersil Corporation |
| 英文描述： | Address Sequencer |
| 中文描述： | 地址序列 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 141K |
| 代理商： | HSP45240 |
9-21
Die Characteristics
DIE DIMENSIONS:
186 mils x 222 mils x 19
±
1mils
METALLIZATION:
Type: Si - Al or Si-Al-Cu
Thickness: 8k
GLASSIVATION:
Type: Nitrox
Thickness: 10k
WORST CASE CURRENT DENSITY:
1.8 x 10
5
A/cm
2
Metallization Mask Layout
HSP45240/883
G
O
O
V
C
O
O
G
O
O
V
C
O
O
G
O
O
O
O
O
D
S
S
A
V
C
B
B
D
G
O
O
V
C
O
D0
D1
D2
D3
D4
D5
D6
GND
WR
A0
CS
GND
V
CC
RST
CLK
OUT12
GND
OUT11
OUT10
V
CC
OUT9
OUT8
GND
OUT7
OUT6
V
CC
OUT5
GND
OUT3
OUT4
HSP45240/883
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
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| HSP45240883 | Address Sequencer |
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| HSP45256GC-33 | Binary Correlator |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSP45240 WAF | 制造商:Intersil Corporation 功能描述: |
| HSP45240/883 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Address Sequencer |
| HSP45240_04 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Address Sequencer |
| HSP45240_99 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Address Sequencer |
| HSP45240883 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Address Sequencer |
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