
Device Selection Guide
High
Footprint
(mm)
[1][2]
Efficiency
Red
Orange
Yellow
Green
1.6 x 0.8 x 0.6
HSMS-H690
HSMD-H690
HSMY-H690
HSMG-H690
2.0 x 1.25 x 1.1
HSMS-H670
HSMD-H670
HSMY-H670
HSMG-H670
H
Surface Mount Flip Chip LEDs
Technical Data
Features
Improved Reliability
Through Elimination of
Internal Wire Bond
-40 to 85
°
C Operating
Temperature Range
Small Size
Industry Standard Footprint
Diffused Optics
Compatible with IR
Solder Process
Four Colors Available
Available in 8 mm Tape on 7"
(178 mm) Diameter Reels
Applications
Keypad Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
Description
The HSMX-H670 and HSMX-H690
introduce a revolutionary concept
to the world of LEDs. The internal
flip chip construction eliminates
the wire bond between the chip
and printed circuit board.
Consequently as a result of the
robust construction, product
reliability is greatly improved.
The HSMX-H670 and HSMX-H690
are available in four colors. The
HSMX-H670 adheres to the
industry standard 2.0 x 1.25 mm
footprint and is intended for
designs where space is limited.
The small size, low 1.1 mm profile
and wide viewing angle make these
LEDs excellent for backlighting
applications and front panel
illumination. The HSMX-H690
adheres to the 1.6 x 0.8 mm
HSMX-H670 Series
HSMX-H690 Series
Notes:
1. Dimensions in mm.
2. Tolerance
±
0.1 mm unless otherwise noted.
industry standard footprint. The
low 0.6 mm profile make this
excellent for designs where
space is limited.
Both packages are compatible
with IR and convective reflow
soldering processes.