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參數(shù)資料
| 型號(hào)： | HSDL-3600 |
| 英文描述： | RES THICK FILM POWER 30 OHM 25W |
| 中文描述： | 紅外符合4 Mb / s的3伏紅外線收發(fā)器 |
| 文件頁(yè)數(shù)： | 20/34頁(yè) |
| 文件大?。?/td> | 567K |
| 代理商： | HSDL-3600 |
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20
2.1 Recommended Metal
Solder Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
See Fig 4.0
t, nominal stencil thickness
mm
0.152
0.127
w
, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
l, length of aperture
mm
2.8
±
0.05
3.4
±
0.05
inches
0.006
0.005
inches
0.110
±
0.002
0.134
±
0.002
3.0 Pick and Place
Misalignment Tolerance and
Product Self-Alignment after
Solder Reflow
If the printed solder paste volume
is adequate,
the unit will self-
align
in the X-direction after
solder reflow. Units should be
properly reflowed in IR Hot Air
convection oven using the
recommended reflow profile. The
direction of board travel does not
matter.
Allowable Misalignment Tolerance
X – direction
Theta
– direction
≤
0.2 mm (0.008 inches)
+/- 2 degrees
APERTURE AS PER
LAND DIMENSIONS
SOLDER
PASTE
l
w
t (STENCIL THICKNESS)
Figure 4.0 Solder Paste Stencil Aperture.
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| HSDL-3612-007 | IrDA Data Compliant 115.2kb/s 3V to 5V Infrared Transceiver |
| HSDL-3612-008 | IrDA Data Compliant 115.2kb/s 3V to 5V Infrared Transceiver |
| HSDL-3612-037 | IrDA Data Compliant 115.2kb/s 3V to 5V Infrared Transceiver |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HSDL-3600#007 | 制造商:Hewlett Packard Co 功能描述:SPECIALTY INTERFACE CIRCUIT, SMA10 |
| HSDL-3600#008 | 制造商:Hewlett Packard Co 功能描述:SPECIALTY INTERFACE CIRCUIT, SMA10 |
| HSDL-3600#017 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FIBER OPTIC TRANSCEIVER |
| HSDL-3600#018 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FIBER OPTIC TRANSCEIVER |
| HSDL3600008 | 制造商:AGILENT 功能描述:NEW |
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