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參數(shù)資料
| 型號： | HPND-4038 |
| 英文描述： | Beam lead Diodes for switching applications |
| 中文描述： | 用于交換應用梁式引線二極管 |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 38K |
| 代理商： | HPND-4038 |
2-93
Small Signal RF PIN Diode Chips
for Hybrid Integrated Circuits
Technical Data
Features
Thermocompression/
Thermosonically Bondable
Ideal for Hybrid Integrated
Circuits
Gold Metallization
Silicon Nitride Passivation
Uniform Electrical
Characteristics
Batch Matched Versions
Available
Planar Construction
HPND-0001
HPND-0002
Outline 01B
Chip Dimensions
D
X
Y
X
DIMENSIONS
D
X
Y
TOP CONTACT
BOTTOM
CONTACT
DIMENSIONS IN MILLIMETERS (1/1000 INCH).
FOR EPOXY OR EUTECTIC
DIE ATTACH
PART NO. HPND-
-0001
0.25
(10)
0.51
(20)
0.15
(6)
CATHODE
ANODE
-0002
0.20
(8)
0.38
(15)
0.15
(6)
CATHODE
ANODE
(0.03) (1)
(0.05) (2)
(0.03) (1)
Description
These PIN/NIP diode chips are
specifically designed for hybrid
applications requiring thermo-
sonic or thermocompression
bonding techniques. The top
metallization is a layer of gold for
a tarnish free surface that allows
either thermosonic or
thermocompression bonding
techniques. The bottom metalli-
zation is also gold, suitable for
epoxy or eutectic die attach
method.
Applications
These small signal, general
purpose PIN/NIP diode chips are
optimized for various analog and
digital applications such as
switches, digital phase shifters,
pulse and amplitude modulators,
limiters, leveling, and attenuating.
5965-9143E
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