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參數(shù)資料
| 型號： | HMMC-2027 |
| 元件分類： | 開關(guān) |
| 英文描述： | 0 MHz - 26500 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 3 dB INSERTION LOSS |
| 封裝： | CHIP |
| 文件頁數(shù)： | 1/6頁 |
| 文件大?。?/td> | 76K |
| 代理商： | HMMC-2027 |
7-32
DC – 26.5 GHz SPDT GaAs MMIC
Switch
Technical Data
HMMC-2027
Features
Outputs Terminated in 50
When Off
Frequency Range:
DC- 26.5 GHz
Insertion Loss:
2.5dB @ 26.5 GHz
Isolation: >70 dB @ 45 MHz
30 dB @ 26.5 GHz
Return Loss:
15 dB (Both Input and Selected
Output)
12 dB Unselected Output
Switching Speed:
<1 ns (10%-90% RF)
P-1dB: 18 dBm @ 10 MHz
27 dBm @ 2 GHz
Harmonics (DC Coupled):
<-45 dBc @ 10 MHz and 5 dBm
<-65 dBc @ 2 GHz and 5 dBm
Description
The HMMC-2027 is a GaAs
monolithic microwave integrated
circuit (MMIC) designed for low
insertion loss and high isolation
from DC to 26.5 GHz. It is
intended for use as a general-
purpose, single-pole, double-
throw (SPDT), absorptive switch.
Two series and two shunt
MESFETs per throw provide 3 dB
maximum insertion loss and
30 dB minimum isolation at
26.5 GHz. HMMC-2027 chips use
through-substrate vias to provide
ground connections to the chip
backside and minimize the
number of wire bonds required.
Chip Size:
900 x 960
m (35.4 x 37.8 mils)
Chip Size Tolerance:
± 10m(± 0.4mils)
Chip Thickness:
127
± 15m(5.0± 0.6mils)
Pad Dimensions:
80 x 80
m (3.2 x 3.2 mils), or larger
Absolute Maximum Ratings[1]
Symbol
Parameters/Conditions
Units
Min.
Max.
Vsel
Select Voltages 1 and 2
V
-10.5
+3
Pin
RF Input Power
dBm
25
Top
Operating Temperature
°C
-55
+125
TSTG
Storage Temperature
°C
-65
+165
Tmax
Maximum Assembly Temp.
°C
+200
Punsel[2]
Power into Unselected Output
dBm
15
Notes:
1. Operation in excess of any one of these conditions may result in permanent
damage to this device. TA = 25°C except for Top, TSTG, and Tmax.
2. Operation in excess of these @ Top-max may result in permanent damage.
RF
IN
RF
OUT2
CHIP ID
RF
OUT1
SEL1
SEL2
5965-5450E
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HMMC-3002 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3004 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/4 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3008 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/8 16000MHZ CHIP - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3022 | 制造商:Agilent Technologies 功能描述:PRESCALER 5V 1/2 12000MHZ - Gel-pak, waffle pack, wafer, diced wafer on film |
| HMMC-3024 | 功能描述:預定標器 Chip GaAs 12 GHz RoHS:否 制造商:ON Semiconductor 最大工作頻率:1100 MHz 最小工作頻率:100 MHz 電源電壓-最小:4.5 V 電源電壓-最大:5.5 V 工作電源電壓:5 V 最小工作溫度:- 40 C 最大工作溫度:+ 85 C 封裝:Tube |
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