參數(shù)資料
型號: HMC539LP3E
廠商: Hittite Microwave Corporation
文件頁數(shù): 4/6頁
文件大?。?/td> 234K
描述: ATTENUATOR DGTL 5BIT 3X3QFN
標準包裝: 1
衰減值: 0.25dB ~ 7.75dB
頻率范圍: 0 ~ 4GHz
阻抗: 50 歐姆
封裝/外殼: 16-VQFN 裸露焊盤
其它名稱: 1127-1052-6
5
5 - 167
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
RF Input Power (DC - 4 GHz)
+29 dBm (T = +85 癈)
Control Voltage Range (V1 to V5)    -1V to Vdd +1V
Bias Voltage (Vdd)
+7.0 Vdc
Channel Temperature
150 癈
Continuous Pdiss (T = 85 癈)
(derate 12.0 mW/癈 above 85 癈)
0.781 W
Thermal Resistance
83 癈/W
Storage Temperature
-65 to +150 癈
Operating Temperature
-40 to +85 癈
ESD Sensitivity (HBM)
Class 1A
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC539LP3 / 539LP3E
0.25 dB LSB GaAs MMIC 5-BIT DIGITAL
POSITIVE CONTROL ATTENUATOR, DC - 4 GHz
v00.0605
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
  PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
  SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
  LAND PATTERN.
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC539LP3
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
539
XXXX
HMC539LP3E
RoHS-compliant Low Stress Injection Molded Plastic    100% matte Sn
MSL1
[2]
539
XXXX
[1] Max peak refl ow temperature of 235 癈
[2] Max peak refl ow temperature of 260 癈
[3] 4-Digit lot number XXXX
Package Information
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相關代理商/技術參數(shù)
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