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參數(shù)資料
| 型號： | HMC473MS8E |
| 廠商： | Hittite Microwave Corporation |
| 文件頁數(shù)： | 5/8頁 |
| 文件大小： | 254K |
| 描述： | ATTENUATOR VOLT VARIABLE 8MSOP |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 衰減值： | 0dB ~ 48dB |
| 頻率范圍： | 450MHz ~ 2.2GHz |
| 阻抗： | 50 歐姆 |
| 封裝/外殼： | 8-TSSOP，8-MSOP（0.118"，3.00mm 寬） |
| 其它名稱： | 1127-1048-6 |
5
5 - 160
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
Control and Bias Voltage
Absolute Maximum Ratings
V
CTL
-0.2 Vdc to Vdd
Vdd
+8 Vdc
Maximum Input Power
Vdd = +3.3 Vdc
+29 dBm
+21 dBm
Min. Atten.
Attenuation >2 dB
Channel Temperature (Tc)
150 癈
Thermal Resistance (R
TH
)
(junction to lead)
92 癈/W
Storage Temperature
-65 to +150 癈
Operating Temperature
-40 to +85 癈
ESD Sensitivity (HBM)
Class 1A
V
CTL
0 to +3 Vdc @ 1 糀
Vdd
+3.3 Vdc ?0.1 Vdc @ 10 糀
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC473MS8
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H473
XXXX
HMC473MS8E
RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
MSL1
[2]
H473
XXXX
[1] Max peak refl ow temperature of 235 癈
[2] Max peak refl ow temperature of 260 癈
[3] 4-Digit lot number XXXX
Package Information
GaAs MMIC VOLTAGE VARIABLE
ATTENUATOR, 0.45 - 2.2 GHz
HMC473MS8 / 473MS8E
v01.1105
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