參數(shù)資料
型號(hào): HMC470LP3E
廠商: Hittite Microwave Corporation
文件頁(yè)數(shù): 4/6頁(yè)
文件大?。?/td> 263K
描述: ATTENUATOR DGTL 5BIT 16QFN
標(biāo)準(zhǔn)包裝: 1
衰減值: 1dB ~ 31dB
頻率范圍: 0 ~ 3GHz
阻抗: 50 歐姆
封裝/外殼: 16-VQFN 裸露焊盤(pán)
其它名稱(chēng): 1127-1046-6
5
5 - 147
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
Outline Drawing
RF Input Power (DC - 3 GHz)
+27 dBm (T = +85 癈)
Control Voltage Range (V1 to V5)    -1V to Vdd +1V
Bias Voltage (Vdd)
+7V
Channel Temperature
150 癈
Continuous Pdiss (T = 85 癈)
(derate 7.7 mW/癈 above 85 癈)
0.5 W
Thermal Resistance
130 癈/W
Storage Temperature
-65 to +150 癈
Operating Temperature
-40 to +85 癈
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
  PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
  SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
  LAND PATTERN.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC470LP3
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
470
XXXX
HMC470LP3E
RoHS-compliant Low Stress Injection Molded Plastic    100% matte Sn
MSL1
[2]
470
XXXX
[1] Max peak refl ow temperature of 235 癈
[2] Max peak refl ow temperature of 260 癈
[3] 4-Digit lot number XXXX
Package Information
HMC470LP3 / 470LP3E
v04.1108
1 dB LSB GaAs MMIC 5-BIT DIGITAL
POSITIVE CONTROL ATTENUATOR, DC - 3 GHz
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