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參數(shù)資料
| 型號： | HM62V16514I |
| 廠商： | Renesas Technology Corp. |
| 英文描述： | Wide Temperature Range Version 8 M SRAM (512-kword x 16-bit) |
| 中文描述： | 寬溫版本八米的SRAM（512 - KWord的x 16位） |
| 文件頁數(shù)： | 16/19頁 |
| 文件大?。?/td> | 97K |
| 代理商： | HM62V16514I |
HM62V16514I Series
14
Low V
CC
Data Retention Characteristics
(Ta = –40 to +85
°
C)
Parameter
Symbol
Min
Typ
*
4
Max
Unit
Test conditions
*
3
V
CC
for data retention
V
DR
2.0
—
3.6
V
Vin
≥
0V
(1)
CS
≥
V
CC
– 0.2 V or
(2)
LB
=
UB
≥
V
CC
– 0.2 V
CS
≤
0.2 V
V
CC
= 3.0 V, Vin
≥
0V
(1)
CS
≥
V
CC
– 0.2 V or
(2)
LB
=
UB
≥
V
CC
– 0.2 V
CS
≤
0.2 V
Data retention current
I
CCDR
*
1
—
0.5
25
μ
A
I
CCDR
*
2
—
0.5
10
μ
A
Chip deselect to data retention time t
CDR
Operation recovery time
Notes: 1. This characteristic is guaranteed only for L version.
2. This characteristic is guaranteed only for L-SL version.
3.
CS
controls address buffer,
WE
buffer,
OE
buffer,
LB
,
UB
buffer and Din buffer. If
CS
controls data
retention mode, Vin levels (address,
WE
,
OE
,
LB
,
UB
, I/O) can be in the high impedance state. If
LB
,
UB
controls data retention mode,
LB
,
UB
must be
LB
=
UB
≥
V
– 0.2 V,
CS
must be
CS
≤
0.2
V. The other input levels (address,
WE
,
OE
, I/O) can be in the high impedance state.
4. Typical values are at V
CC
= 3.0 V, Ta = +25C and not guaranteed.
5. t
RC
= read cycle time.
0
—
—
ns
See retention waveform
t
R
t
RC
*
5
—
—
ns
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