參數(shù)資料
型號: HLX6228ASN
廠商: Electronic Theatre Controls, Inc.
英文描述: 128K x 8 STATIC RAM?Low Power SOI
中文描述: 128K的× 8靜態(tài)RAM?低功耗絕緣硅
文件頁數(shù): 10/12頁
文件大?。?/td> 156K
代理商: HLX6228ASN
HLX6228
10
The 128K x 8 SRAM is offered in a custom 32-lead or 40-
lead flat pack (FP). The packages are constructed of
multilayer ceramic (Al
2
O
3
) and feature internal power and
ground planes. Ceramic chip capacitors can be mounted to
the package by the user to maximize supply noise
decoupling and increase board packing density. These
PACKAGING
32-LEAD FLAT PACK
(22018533-001)
[1] BSC - Basic lead spacing between centers
[2] Where lead is brazed to package
[3] Parts delivered with leads unformed
[4] Lid connected to VSS
A
b
C
D
e
E
E2
E3
F
L
Q
S
U
V
W
X
Y
Z
0.135 ± 0.015
0.017 ± 0.002
0.004 to 0.009
0.820 ± 0.008
0.050 ± 0.005 [1]
0.600 ± 0.008
0.500 ± 0.008
0.040 ref
0.750 ± 0.005 [2]
0.295 min [3]
0.026 to 0.045
0.035 ± 0.010
0.080 ref
0.380 ref
0.050 ref
0.075 ref
0.010 ref
0.135 ref
All dimensions in inches
22018533-001
E
1
e
b
D
(width)
(pitch)
F
L
TOP
VIEW
E2
A
Lead
Alloy 42
Ceramic
Body
C
E3
Cutout
Area
Q
Kovar
Lid [4]
V
Optional capacitors
in cutout
1
VSS
VDD
VDD
S
U
Z
X
W
Y
BOTTOM
VIEW
32-LEAD FLAT PACK PINOUT
VDD
A15
CE
NWE
A13
A8
A9
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Top
View
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
capacitors attach directly to the internal package power
and ground planes. This design minimizes resistance and
inductance of the bond wire and package. All NC (no
connect) pins
should
be connected to VSS
to prevent
charge
build up in the radiation
environment.
A15
VSS
VDD
NWE
CE
A13
A8
A9
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
VSS
NC
A16
VSS
VDD
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
NC
VDD
VSS
NC
Top
View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
40-LEAD FLAT PACK PINOUT
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