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參數(shù)資料
| 型號(hào)： | HJZ-B-100 |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大小： | 23K |
| 代理商： | HJZ-B-100 |
Key to Pads and Signal State
B - Outline
GENERAL SPECIFICATIONS
Impedance:
Coupling:
CW Input:
Weight, nominal:
Operating Temperature: -- 55° to +85°C
50
nom.
-- 3 dB nom.
1 Watt max.
0.007 oz (200 mg)
PRINCIPAL SPECIFICATIONS
Frequency
Range,
MHz
Performance
Bandwidth,
MHz
Isolation,
E - H Ports, Loss, dB,
dB, Min.
Insertion
Amplitude
Balance, dB,
Max.
Phase
Balance,
Max.
Model
Number
VSWR,
Max.
Max.
HJZ-B-100
1 - 200 MHz
2 - 100
1 - 200
30
20
0.5
0.8
0.2
0.4
±
3°
±
5°
1.3:1
1.5:1
HJZ-B-100
1 to 200 MHz / Symmetrical Phase / High Isolation / Low Insertion Loss / CaseFree Package
0
°
/180
°
POWER DIVIDER / COMBINER
Σ
(Sum)
Pad 2
Isol.
In
(Delta)
Pad 3
In
Isol.
Co-Linear
1
Pad 1
0° ref.
0° ref.
Co-Linear
2
Pad 4
-- 180°
0°
For further information contact
MERRIMAC / 41 Fairfield Pl., West Caldwell, NJ, 07006 / 973-575-1300 / FAX 973-575-0531
General Notes:
1. The HJZ-B series of 0°/180° hybrid junctions covers
1 to 200 MHz using lumped element technology to
achieve good isolation and balance over wide
bandwidths.
2. These units have been designed for size and
process compatibility with MMIC and similar devices.
In particular, the height of the component is limited to
0.130" so that it can be mounted with other miniature
components in a low profile hermetic housing.
3. The metallized alumina substrate may be attached
to the main ground plane using silver epoxy or solder
while signal leads may be wire bonded, epoxied or
soldered to the gold pads.
4. All units comply with MIL-P-23971 and can be
supplied screened to comply with specifications you
designate for high reliability applications.
NOTES:
±
.010(.25) except as noted.
1. Tolerance on 3 place decimals
24May96
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