參數(shù)資料
型號(hào): HIP0081AS2
廠(chǎng)商: HARRIS SEMICONDUCTOR
元件分類(lèi): 外設(shè)及接口
英文描述: Potentiometer; Series:CMU; Track Resistance:1kohm; Power Rating:2W; Operating Temperature Range:-55 C to +120 C; Adjustment Type:Knob; Leaded Process Compatible:Yes; Mechanical Angle/Rotation:312 RoHS Compliant: Yes
中文描述: 1.25 A 4 CHANNEL, BUF OR INV BASED PRPHL DRVR, PSFM15
文件頁(yè)數(shù): 12/15頁(yè)
文件大?。?/td> 115K
代理商: HIP0081AS2
12
HIP0080, HIP0081
Plastic Leaded Chip Carrier Packages (PLCC)
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
contact point.
-C-
A1
A
SEATING
PLANE
0.020 (0.51)
MIN
VIEW “A”
D2/E2
0.025 (0.64)
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
E
E1
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
C
D1
D
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
0.004 (0.10)
C
-C-
D2/E2
C
N28.45
(JEDEC MS-018AB ISSUE A)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.485
0.495
12.32
12.57
-
D1
0.450
0.456
11.43
11.58
3
D2
0.191
0.219
4.86
5.56
4, 5
E
0.485
0.495
12.32
12.57
-
E1
0.450
0.456
11.43
11.58
3
E2
0.191
0.219
4.86
5.56
4, 5
N
28
28
6
Rev. 2 11/97
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