- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371819 > HIN239CB-T (Integrated Silicon Solution, Inc.) 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors PDF資料下載
參數(shù)資料
| 型號(hào)： | HIN239CB-T |
| 廠商： | Integrated Silicon Solution, Inc. |
| 元件分類： | RS-232 |
| 英文描述： | 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors |
| 中文描述： | 5V的高速RS - 232收發(fā)器與0.1uF電容 |
| 文件頁(yè)數(shù)： | 18/19頁(yè) |
| 文件大小： | 617K |
| 代理商： | HIN239CB-T |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)當(dāng)前第18頁(yè)第19頁(yè)
18
HIN232 thru HIN241
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual in-
dex feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
μ
α
0.25(0.010)
B
M
M
0.25
0.010
GAUGE
PLANE
A2
M28.209
(JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 1 3/95
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HIN239CBZ-T | 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors |
| HIN239 | 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors |
| HIN239CB | 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors |
| HIN239CBZ | 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors |
| HIN239CP | 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HIN239CBZ | 功能描述:RS-232接口集成電路 RS232 5V/12V 3D/5R 1UF CAPS 24 COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| HIN239CBZ-T | 功能描述:RS-232接口集成電路 RS232 5V/12V 3D/5R 1UF CAPS 24 COMEL RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| HIN239CP | 功能描述:IC 3DRVR/5RCV RS232 5/12V 24-DIP RoHS:否 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 類型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| HIN239CPZ | 功能描述:RS-232接口集成電路 RS232 5V/12V 3D/5R 1UF CAPS 24PDIP COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝: |
| HIN239IB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。