參數(shù)資料
型號(hào)： HIN232IPZ
廠商： Intersil
文件頁(yè)數(shù)： 8/21頁(yè)
文件大?。?/td> 0K
描述： IC 2DRVR/2RCVR RS232 5V 16-DIP
標(biāo)準(zhǔn)包裝： 25
類型： 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù)： 2/2
規(guī)程： RS232
電源電壓： 4.5 V ~ 5.5 V
安裝類型： 通孔
封裝/外殼： 16-DIP（0.300"，7.62mm）
供應(yīng)商設(shè)備封裝： 16-PDIP
包裝： 管件
16
FN3138.16
September 26, 2008
HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
BS
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A-
0.210
-
5.33
4
A1
0.015
-
0.39
-4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8
C
0.008
0.014
0.204
0.355
-
D
1.230
1.280
31.24
32.51
5
D1
0.005
-
0.13
-5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N24
24
9
Rev. 0 12/93
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