FN4315.16 November 4, 2005 HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E Shrink Small Outline Plastic Packages (SSOP)" />
參數(shù)資料
型號: HIN202ECBZ
廠商: Intersil
文件頁數(shù): 14/22頁
文件大?。?/td> 0K
描述: IC TXRX RS-232 5V ESD 16-SOIC
標準包裝: 48
類型: 收發(fā)器
驅(qū)動器/接收器數(shù): 2/2
規(guī)程: RS232
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 管件
產(chǎn)品目錄頁面: 1239 (CN2011-ZH PDF)
21
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
α
0.25
0.010
GAUGE
PLANE
A2
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N28
28
7
α
-
Rev. 2 6/05
相關(guān)PDF資料
PDF描述
AD7899ARZ-2 IC ADC 14BIT 400KSPS 5V 28SOIC
HIN232ACBZ IC 2DRVR/2RCVR RS232 5V 16-SOIC
VI-B4J-MX-F2 CONVERTER MOD DC/DC 36V 75W
AD7356YRUZ IC ADC DUAL 12BIT 5MSPS 16TSSOP
VI-B4J-MW CONVERTER MOD DC/DC 36V 100W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HIN202ECBZ-T 功能描述:RS-232接口集成電路 RS232 5V 2D/2R 15KV 16 COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝:
HIN202ECP 功能描述:IC TXRX RS-232 5V ESD 16-DIP RoHS:否 類別:集成電路 (IC) >> 接口 - 驅(qū)動器,接收器,收發(fā)器 系列:- 標準包裝:1,000 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
HIN202ECPZ 功能描述:RS-232接口集成電路 W/ANNEAL RS232 5V 2D /2R 15KV 16PDIP COM RoHS:否 制造商:Exar 數(shù)據(jù)速率:52 Mbps 工作電源電壓:5 V 電源電流:300 mA 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:LQFP-100 封裝:
HIN202EIA 制造商:Rochester Electronics LLC 功能描述:- Bulk
HIN202EIB 功能描述:IC 2DRVR/2RCVR RS232 5V 16-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 驅(qū)動器,接收器,收發(fā)器 系列:- 標準包裝:1,000 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)