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參數(shù)資料
| 型號： | HI9P0201HS-9Z |
| 廠商： | Intersil |
| 文件頁數(shù)： | 3/11頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH QUAD SPST 16SOIC |
| 標(biāo)準(zhǔn)包裝： | 480 |
| 功能： | 開關(guān) |
| 電路： | 4 x SPST - NC |
| 導(dǎo)通狀態(tài)電阻： | 50 歐姆 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±15V |
| 電流 - 電源： | 4.5mA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-SOIC |
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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Die Characteristics
DIE DIMENSIONS
2440
m x 2860m x 485m
METALLIZATION
Type: CuAl
Thickness: 16k
±2k
PASSIVATION
Type: Nitride Over Silox
Nitride Thickness: 3.5k
±1k
Silox Thickness: 12k
±2k
WORST CASE CURRENT DENSITY
9.5 x 104 A/cm2
Metallization Mask Layout
HI-201HS
A1
A2
OUT2
IN2
V+
IN3
OUT3
A3
A4
OUT4
IN4
GND
V-
IN1
OUT1
HI-201HS
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相關(guān)代理商/技術(shù)參數(shù) |
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| HI9P0222-9 | 制造商:Harris Corporation 功能描述: |
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| HI9P0222-9 WAF | 制造商:Harris Corporation 功能描述: |
| HI9P0300-5 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| HI9P0301-5 | 制造商:Rochester Electronics LLC 功能描述:SWITCH 1X SPDT N.B. 14SOIC COM - Bulk |
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