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參數(shù)資料
| 型號： | HI9P0201HS-5Z |
| 廠商： | INTERSIL CORP |
| 元件分類： | 運動控制電子 |
| 英文描述： | Header; No. of Contacts:50; Pitch Spacing:0.079"; No. of Rows:2; Gender:Male; Series:1552; Body Material:Glass Filled Polyester; Connector Retention Style:Latch/Ejector; Contact Termination:Through Hole; Housing Style:Right-Angle RoHS Compliant: Yes |
| 中文描述： | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16 |
| 封裝： | LEAD FREE, SOIC-16 |
| 文件頁數(shù)： | 11/11頁 |
| 文件大?。?/td> | 253K |
| 代理商： | HI9P0201HS-5Z |
11
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
2440
μ
m x 2860
μ
m x 485
μ
m
METALLIZATION:
Type: CuAl
Thickness: 16k
±
2k
PASSIVATION:
Type: Nitride Over Silox
Nitride Thickness: 3.5k
±
1k
Silox Thickness: 12k
±
2k
WORST CASE CURRENT DENSITY:
9.5 x 10
4
A/cm
2
Metallization Mask Layout
HI-201HS
A1
A2
OUT2
IN2
V+
IN3
OUT3
A3
A4
OUT4
IN4
GND
V-
IN1
OUT1
HI-201HS
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HI9P0201HS-9 | Header; No. of Contacts:50; Pitch Spacing:0.079"; No. of Rows:2; Gender:Male; Series:1552; Body Material:Glass Filled Polyester; Connector Retention Style:Latch/Ejector; Contact Termination:Through Hole; Housing Style:Right-Angle RoHS Compliant: Yes |
| HI9P0201HS-9Z | Header; No. of Contacts:50; Pitch Spacing:0.079"; No. of Rows:2; Gender:Male; Series:1552; Body Material:Glass Filled Polyester; Connector Retention Style:Latch/Ejector; Contact Termination:Through Hole; Housing Style:Right-Angle RoHS Compliant: Yes |
| HI9P0201-5 | Dual/Quad SPST, CMOS Analog Switches |
| HI9P0201-9 | Dual/Quad SPST, CMOS Analog Switches |
| HI-201HS | Flash 8Mb PROM (ST Micro), |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HI9P0201HS-9 | 功能描述:IC SWITCH QUAD SPST 16SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:48 系列:- 功能:開關(guān) 電路:4 x SPST - NO 導(dǎo)通狀態(tài)電阻:100 歐姆 電壓電源:單/雙電源 電壓 - 電源，單路/雙路(±):2 V ~ 12 V，±2 V ~ 6 V 電流 - 電源:50nA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:管件 |
| HI9P0201HS-9Z | 功能描述:模擬開關(guān) IC SWITCH 4X SPST N C 16W IND RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| HI9P0222-9 | 制造商:Harris Corporation 功能描述: |
| HI9P-0222-9 WAF | 制造商:Harris Corporation 功能描述: |
| HI9P0222-9 WAF | 制造商:Harris Corporation 功能描述: |
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