參數(shù)資料
| 型號： | HI5731BIPZ |
| 廠商： | Intersil |
| 文件頁數(shù)： | 8/17頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 12BIT 100MSPS HS 28DIP |
| 標準包裝： | 78 |
| 設置時間： | 20ns |
| 位數(shù)： | 12 |
| 數(shù)據接口： | 并聯(lián) |
| 轉換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字，雙 ± |
| 功率耗散（最大）： | 650mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 28-DIP（0.600"，15.24mm） |
| 供應商設備封裝： | 28-PDIP |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 2 電流，單極 |
| 采樣率（每秒）： | 100M |
16
HI5731
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
BS
E28.6 (JEDEC MS-011-AB ISSUE B)
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.250
-
6.35
4
A1
0.015
-
0.39
-
4
A2
0.125
0.195
3.18
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.030
0.070
0.77
1.77
8
C
0.008
0.015
0.204
0.381
-
D
1.380
1.565
35.1
39.7
5
D1
0.005
-
0.13
-
5
E
0.600
0.625
15.24
15.87
6
E1
0.485
0.580
12.32
14.73
5
e
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
6
eB
-
0.700
-
17.78
7
L
0.115
0.200
2.93
5.08
4
N28
28
9
Rev. 1 12/00
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相關代理商/技術參數(shù) |
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|---|---|
| HI5731D DIE | 制造商:Harris Corporation 功能描述: |
| HI5731-EVP | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| HI5731-EVS | 功能描述:數(shù)據轉換 IC 開發(fā)工具 HI5731 EVAL PL ATFORM FOR RoHS:否 制造商:Texas Instruments 產品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| HI5735 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:12-Bit, 80 MSPS, High Speed Video D/A Converter |
| HI5735_04 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:12-Bit, 80 MSPS, High Speed Video D/A Converter |
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