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參數(shù)資料
| 型號： | HI3-674AKN-5 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 13/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 12BIT 67KSPS 28-SBDIP |
| 標(biāo)準(zhǔn)包裝： | 13 |
| 位數(shù)： | 12 |
| 采樣率（每秒）： | 67k |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 功率耗散（最大）： | 720mW |
| 電壓電源： | 雙 ± |
| 工作溫度： | 0°C ~ 75°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 28-DIP（0.600"，15.24mm） |
| 供應(yīng)商設(shè)備封裝： | 28-PDIP |
| 包裝： | 管件 |
| 輸入數(shù)目和類型： | 2 個單端，單極；2 個單端，雙極 |
4
FN3096.6
August 7, 2008
Absolute Maximum Ratings
Thermal Information
Supply Voltage
VCC to Digital Common . . . . . . . . . . . . . . . . . . . . . . 0V to +16.5V
VEE to Digital Common . . . . . . . . . . . . . . . . . . . . . . . 0V to -16.5V
VLOGIC to Digital Common . . . . . . . . . . . . . . . . . . . . . . 0V to +7V
Analog Common to Digital Common . . . . . . . . . . . . . . . . . . . .±1V
Control Inputs
(CE, CS, AO, 12/8, R/C) to Digital Common . . -0.5V to VLOGIC +0.5V
Analog Inputs
(REFIN, BIPOFF, 10VIN) to Analog Common . . . . . . . . . . ±16.5V
20VIN to Analog Common . . . . . . . . . . . . . . . . . . . . . . . . . . ±24V
REFOUT . . . . .Indefinite Short To Common, Momentary Short To VCC
Operating Conditions
Temperature Range
HI3-574Axx-5, HI1-674Axx-5 . . . . . . . . . . . . . . . . . . 0°C to +75°C
HI1-574AxD-2, HI1-674AxD-2 . . . . . . . . . . . . . . .-55°C to +125°C
Thermal Resistance (Typical, Note 4)
θ
JA (°C/W)
θ
JC (°C/W)
SBDIP Package . . . . . . . . . . . . . . . . . .
55
18
PDIP Package* . . . . . . . . . . . . . . . . . . .
60
N/A
Maximum Junction Temperature
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Maximum Storage Temperature Range
PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
Die Characteristics
Transistor Count
HI-574A, HI-674A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1117
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
4.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC and Transfer Accuracy Specifications Typical at +25°C with VCC = +15V or +12V, VLOGIC = +5V, VEE = -15V or -12V;
Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise
specified. Temperature limits established by characterization and are not
production tested.
PARAMETER
TEMPERATURE RANGE
-5 (0°C to +75°C)
UNITS
J SUFFIX
K SUFFIX
DYNAMIC CHARACTERISTICS
Resolution (Max)
12
Bits
Linearity Error
+25°C (Max)
±1
±1/2
LSB
0°C to +75°C (Max)
±1
±1/2
LSB
Max Resolution For Which No Missing Codes Is Guaranteed
+25°C
12
Bits
TMIN to TMAX
11
12
Bits
Unipolar Offset (Max)
Adjustable to Zero
±2
±1.5
LSB
Bipolar Offset (Max)
VIN = 0V (Adjustable to Zero)
±4
LSB
VIN = -10V
±0.15
±0.1
% of FS
Full Scale Calibration Error
+25°C (Max), With Fixed 50
Ω Resistor From REF OUT To REF IN
(Adjustable to Zero)
±0.25
% of FS
TMIN to TMAX (No Adjustment At +25°C)
±0.475
±0.375
% of FS
TMIN to TMAX (With Adjustment To Zero +25°C)
±0.22
±0.12
% of FS
HI-574A, HI-674A
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