參數(shù)資料
型號(hào): HI3-0548-5Z
廠商: Intersil
文件頁數(shù): 16/24頁
文件大小: 0K
描述: IC MULTIPLEXER 8X1 16PDIP
標(biāo)準(zhǔn)包裝: 250
功能: 多路復(fù)用器
電路: 1 x 8:1
導(dǎo)通狀態(tài)電阻: 1.8 千歐
電壓電源: 雙電源
電壓 - 電源,單路/雙路(±): ±5 V ~ 18 V
電流 - 電源: 500µA
工作溫度: 0°C ~ 75°C
安裝類型: *
封裝/外殼: *
供應(yīng)商設(shè)備封裝: *
包裝: *
23
HI-546, HI-547, HI-548, HI-549
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
BS
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.735
0.775
18.66
19.68
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N16
16
9
Rev. 0 12/93
相關(guān)PDF資料
PDF描述
GBE05DHHN CONN EDGECARD 10POS 1MM DIP SLD
ESC60DRYH CONN EDGECARD 120PS DIP .100 SLD
H7FFH-3710M CABLE D-SUB-HFP37H/AE37M/HFP37H
RMC05DREN CONN EDGECARD 10POS .100 EYELET
R0.25D-2409/P-R CONV DC/DC 0.25W 24VIN +/-9VOUT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HI3-0548-9 制造商:Rochester Electronics LLC 功能描述:- Bulk
HI3-0549-5 功能描述:IC MULTIPLEXER DUAL 4X1 16DIP RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關(guān),多路復(fù)用器,多路分解器 系列:- 標(biāo)準(zhǔn)包裝:48 系列:- 功能:開關(guān) 電路:4 x SPST - NO 導(dǎo)通狀態(tài)電阻:100 歐姆 電壓電源:單/雙電源 電壓 - 電源,單路/雙路(±):2 V ~ 12 V,±2 V ~ 6 V 電流 - 電源:50nA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:管件
HI3-0549-5Z 功能描述:多路器開關(guān) IC MUX DIFF 4:1 OVP COM RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻(最大值):7 Ohms 開啟時(shí)間(最大值): 關(guān)閉時(shí)間(最大值): 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16
HI3-0549-9 制造商:Rochester Electronics LLC 功能描述:- Bulk
HI3055 制造商:HSMC 制造商全稱:HSMC 功能描述:NPN EPITAXIAL PLANAR TRANSISTOR