Small Outline Plastic Packages (SOIC) NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Pu" />
參數(shù)資料
型號(hào): HI1-5051-2
廠商: Intersil
文件頁(yè)數(shù): 3/12頁(yè)
文件大?。?/td> 0K
描述: IC SWITCH DUAL SPDT 16CDIP
標(biāo)準(zhǔn)包裝: 25
功能: 開(kāi)關(guān)
電路: 2 x SPDT
導(dǎo)通狀態(tài)電阻: 45 歐姆
電壓電源: 雙電源
電壓 - 電源,單路/雙路(±): ±15V
電流 - 電源: 200µA
工作溫度: -55°C ~ 125°C
安裝類(lèi)型: 通孔
封裝/外殼: 16-CDIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 16-CDIP
包裝: 管件
11
HI-5042 thru HI-5051
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
0.25(0.010)
B
M
α
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.053
0.069
1.35
1.75
-
A1
0.004
0.010
0.10
0.25
-
B
0.014
0.019
0.35
0.49
9
C
0.007
0.010
0.19
0.25
-
D
0.386
0.394
9.80
10.00
3
E
0.150
0.157
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.228
0.244
5.80
6.20
-
h
0.010
0.020
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N16
16
7
α
0o
8o
0o
8o
-
Rev. 1 02/02
相關(guān)PDF資料
PDF描述
VE-B1P-CU-B1 CONVERTER MOD DC/DC 13.8V 200W
HI1-0506-2 IC MULTIPLEXER 16X1 28CDIP
HI1-0509A-2 IC MULTIPLEXER DUAL 4X1 16CDIP
HI1-0548-2 IC MULTIPLEXER 8X1 16CDIP
VI-B1P-CU-B1 CONVERTER MOD DC/DC 13.8V 200W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HI1-5051-2119 制造商:Rochester Electronics LLC 功能描述:- Bulk
HI1-5051-2R1969 制造商:Rochester Electronics LLC 功能描述:- Bulk
HI150515 制造商:HAR 功能描述:5051
HI1-5051-5 功能描述:模擬開(kāi)關(guān) IC SWITCH 2X SPDT N.B. 16CDIP COM RoHS:否 制造商:Texas Instruments 開(kāi)關(guān)數(shù)量:2 開(kāi)關(guān)配置:SPDT 開(kāi)啟電阻(最大值):0.1 Ohms 切換電壓(最大): 開(kāi)啟時(shí)間(最大值): 關(guān)閉時(shí)間(最大值): 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16
HI1-5051-7 制造商:Rochester Electronics LLC 功能描述:- Bulk