參數(shù)資料
型號(hào)： HI-574A
廠商： Intersil Corporation
元件分類： 串行ADC
英文描述： Complete, 12-Bit A/D Converters with Microprocessor Interface(完備的12 位A/D轉(zhuǎn)換器)
中文描述： 完成后，12位A / D與微處理器接口（完備的12位的A / D轉(zhuǎn)換器轉(zhuǎn)換器）
文件頁數(shù)： 4/18頁
文件大?。?/td> 200K
代理商： HI-574A
6-955
Absolute Maximum Ratings
Thermal Information
Supply Voltage
V
CC
to Digital Common . . . . . . . . . . . . . . . . . . . . . . 0V to +16.5V
V
EE
to Digital Common. . . . . . . . . . . . . . . . . . . . . . . 0V to -16.5V
V
LOGIC
to Digital Common. . . . . . . . . . . . . . . . . . . . . . 0V to +7V
Analog Common to Digital Common
±
1V
Control Inputs
(CE, CS, A
O
, 12/8, R/C) to Digital Common . . -0.5V to V
LOGIC
+0.5V
Analog Inputs
(REFIN, BIPOFF, 10VIN) to Analog Common. . . . . . . . . .
±
16.5V
20VIN to Analog Common . . . . . . . . . . . . . . . . . . . . . . . . . .
±
24V
REFOUT . . . . Indefinite Short To Common, Momentary Short To V
CC
Operating Conditions
Temperature Range
HI3-574AxN-5, HI1-574AxD-5 . . . . . . . . . . . . . . . . . .0
o
C to 75
o
C
HI3-674AxN-5, HI1-674AxD-5 . . . . . . . . . . . . . . . . . .0
o
C to 75
o
C
HI3-774xN-5, HI1-774xD-5. . . . . . . . . . . . . . . . . . . . .0
o
C to 75
o
C
HI1-574AxD-2, HI1-674AxD-2, HI1-774xD-2 . . . . -55
o
C to 125
o
C
Thermal Resistance (Typical, Note 1)
CLCC Package . . . . . . . . . . . . . . . . . .
SBDIP Package. . . . . . . . . . . . . . . . . .
HI3-574AxN-5, HI3-674AxN-5, HI3-774xN-5
Maximum Junction Temperature
HI3-574AxN-5, HI3-674AxN-5, HI3-774xN-5. . . . . . . . . . . . 150
o
C
HI1-574AxD-2, HI1-574AxD-5. . . . . . . . . . . . . . . . . . . . . . . 175
o
C
HI1-674AxD-2, HI1-674AxD-5. . . . . . . . . . . . . . . . . . . . . . . 175
o
C
HI1-774xD-2, HI1-774xD-5 . . . . . . . . . . . . . . . . . . . . . . . . . 175
o
C
Maximum Storage Temperature Range
HI3-574AxN-5, HI3-674AxN-5, HI3-774xN-5. . . . . .-40
o
C to 85
o
C
HI1-574AxD-2, HI1-574AxD-5. . . . . . . . . . . . . . . .-65
o
C to 150
o
C
HI1-674AxD-2, HI1-674AxD-5. . . . . . . . . . . . . . . .-65
o
C to 150
o
C
HI1-774xD-2, HI1-774xD-5 . . . . . . . . . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering, 10s) . . . . . . . . . . . . 300
o
C
θ
JA
(
o
C/W)
65
60
65
θ
JC
(
o
C/W)
14
18
N/A
Die Characteristics
Transistor Count
HI-574A, HI-674A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1117
HI-774 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2117
DC and Transfer Accuracy Specifications
Typical at 25
o
C with V
CC
= +15V or +12V, V
LOGIC
= +5V, V
EE
= -15V or -12V,
Unless Otherwise Specified
PARAMETER
TEMPERATURE RANGE
-5 (0
o
C to 75
o
C)
UNITS
J SUFFIX
K SUFFIX
L SUFFIX
DYNAMIC CHARACTERISTICS
Resolution (Max)
12
12
12
Bits
Linearity Error
25
o
C (Max)
±
1
±
1
/
2
±
1
/
2
±
1
/
2
±
1
/
2
LSB
0
o
C to 75
o
C (Max)
±
1
LSB
Max Resolution For Which No Missing Codes Is Guaranteed
25
o
C
HI-574A, HI-674A
12
12
12
Bits
HI-774
11
12
12
Bits
T
MIN
to T
MAX
HI-574A, HI-674A
11
12
12
Bits
HI-774
11
12
12
Bits
Unipolar Offset (Max)
Adjustable to Zero
±
2
±
1.5
±
1
LSB
Bipolar Offset (Max)
V
IN
= 0V (Adjustable to Zero)
±
4
±
4
±
3
LSB
V
IN
= -10V
±
0.15
±
0.1
±
0.1
% of FS
Full Scale Calibration Error
25
o
C (Max), With Fixed 50
Resistor From REF OUT To REF IN
(Adjustable to Zero)
±
0.25
±
0.25
±
0.15
% of FS
T
MIN
to T
MAX
(No Adjustment At 25
o
C)
T
MIN
to T
MAX
(With Adjustment To Zero 25
o
C)
±
0.475
±
0.375
±
0.20
% of FS
±
0.22
±
0.12
±
0.05
% of FS
HI-574A, HI-674A, HI-774
相關(guān)PDF資料
PDF描述
HI3-574ALN-5 Complete, 12-Bit A/D Converters with Microprocessor Interface
HI3-674ALN-5 Complete, 12-Bit A/D Converters with Microprocessor Interface
HI1-574AJD-5 Complete, 12-Bit A/D Converters with Microprocessor Interface
HI1-674AJD-5 Complete, 12-Bit A/D Converters with Microprocessor Interface
HI3-574AJN-5 Complete, 12-Bit A/D Converters with Microprocessor Interface
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HI5760/6IB 功能描述:IC DAC 10-BIT 60MSPS 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:*
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