參數(shù)資料
型號(hào): HFBR-5903E
英文描述: Telecommunication IC
中文描述: 通信集成電路
文件頁(yè)數(shù): 8/16頁(yè)
文件大?。?/td> 446K
代理商: HFBR-5903E
10.82
(0.426)
26.4
(1.04)
1.98
(0.078)
13.82
(0.544)
30.2
(1.19)
14.73
(0.58)
KEEP OUT ZONE
BOTTOM SIDE OF PCB
DIMENSION SHOWN FOR MOUNTING
MODULE
FLUSH TO PANEL. THICKER PANEL WILL
RECESS MODULE. THINNER PANEL WILL
PROTRUDE MODULE.
12.0
(0.47)
0.36
(0.014)
1.27
(0.05)
OPTIONAL SEPTUM
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.
1.82
(0.072)
Ordering Information
850 nm VCSEL (Short Wavelength Laser)
HFBR-53D3 No shield, plastic housing.
HFBR-53D3EM Extended/protruding shield, metallized housing.
HFBR-53D3FM Flush shield, metallized housing.
1300 nm FP Laser (Long Wavelength Laser)
HFCT-53D3EM Extended/protruding shield, metallized housing.
HFCT-53D3FM Flush shield, metallized housing.
Figure 9. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-53D3FM.
www.semiconductor.agilent.com
Data subject to change.
Copyright 2000 Agilent Technologies, Inc.
5968-5302E (11/99)
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