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參數(shù)資料
| 型號： | HFBR-5701LP |
| 英文描述： | 1.25/1.0625 GBd MMF Pluggable (SFP) Transceiver for GbE and Fibre Channel: Bail-wire delatch |
| 中文描述： | 1.25/1.0625 GBd人造纖維可插拔（SFP）收發(fā)器GbE和光纖通道：保釋金線delatch |
| 文件頁數(shù)： | 1/16頁 |
| 文件大?。?/td> | 446K |
| 代理商： | HFBR-5701LP |
1 x 9 Fiber Optic Transceivers
for Fibre Channel
Technical Data
HFBR-53D3 Family,
850 nm VCSEL
HFCT-53D3 Family,
1300 nm FP Laser
Features
HFBR-53D3 is Compliant
with ANSI X3.297-1996
Fibre Channel Physical
Interface FC-PH-2 Revision
7.4 Proposed Specifications
for 100-M5-SN-I and
100-M6-SN-I signal interfaces
HFCT-53D3 is Compliant
with ANSI 100-SM-LC-L
Revision 2 enhancement to
ANSI X3.297-1996 FC-PH-2
Revision 7.4
Industry Standard
Mezzanine Height 1 x 9
Package Style with Integral
Duplex SC Connector
Performance:
HFBR-53D3:
300 m over 62.5/125 m
MMF
500 m over 50/125 m MMF
HFCT-53D3:
500 m with 50/125 m MMF
500 m with 62.5/125 m
MMF
10 km with 9/125 m SMF
IEC 60825-1 Class 1/CDRH
Class I Laser Eye Safe
Single +5 V Power Supply
Operation with PECL Logic
Interfaces
Wave Solderable and
Aqueous Wash Process
Compatible
Applications:
Mass Storage Systems I/O
Computer Systems I/O
High-speed Peripheral
Interface
High-speed Switching
Systems
Host Adapter I/O
RAID Cabinets
Related Products
Physical Layer ICs
Available for optical or
Copper Interface (HDMP-
1536A/46A)
Versions of this Transceiver
Module also available for
Gigabit Ethernet
(HFBR/HFCT-53D5 Family)
Gigabit Interface
Converters (GBIC) for
Fibre Channel (CX, SX, LX)
Description
The HFBR/HFCT-53D3
transceiver from Agilent allows
the system designer to implement
a range of solutions for
multimode and single mode Fibre
Channel applications.
The overall Agilent transceiver
product consists of three sections:
the transmitter and receiver
optical subassemblies, an
electrical subassembly, and the
package housing which
incorporates a duplex SC
connector receptacle.
Transmitter Section
The transmitter section of the
HFBR-53D3 consists of an 850 nm
Vertical Cavity Surface Emitting
Laser (VCSEL) in an optical
subassembly (OSA), which mates
to the fiber cable. The HFCT-53D3
incorporates a 1300 nm Fabry-
Perot (FP) Laser designed to
meet the Fibre Channel
specification. The OSA is driven
by a custom, silicon bipolar IC
which converts differential PECL
logic signals (ECL referenced to a
+5 V supply) into an analog laser
diode drive current.
Receiver Section
The receiver of the HFBR-53D3
includes a silicon PIN photodiode
mounted together with a custom,
silicon bipolar transimpedance
preamplifier IC in an OSA. This
OSA is mated to a custom silicon
bipolar circuit that provides post-
amplification and quantization.
The HFCT-53D3 utilizes an InP
PIN photodiode in the same
configuration.
相關(guān)PDF資料 |
PDF描述 |
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| HFBR-5720AL | 2.125/1.0625 GBd MMF SFP Transceiver for Fibre Channel: Ext Temp & Voltage. Standard delatch |
| HFBR-5720ALP | Optoelectronic |
| HFBR-5730L | 1.0625 GBd MMF Small Form Factor Pluggable (SFP) Transceiver for Fibre Channel: Standard delatch |
| HFBR-5730LP | 1.0625 GBd MMF Small Form Factor Pluggable (SFP) Transceiver for Fibre Channel: Bail-wire delatch |
| HFBR-5803 | 100/125 Mbit/s MMF (2 km) 1x9 SC Duplex Transceiver for Fast Ethernet (100Base-FX) /ATM/FDDI |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HFBR5710L | 制造商:Agilent Technologies 功能描述: |
| HFBR-5710L | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 3.3V MM GbE SFP Txcv r LC Std Latch RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長:850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
| HFBR-5710LP | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 3.3V MM GbE SFP Txcv r LC Ext Latch RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長:850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
| HFBR-5720AL | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 MM 2Gbps SFP W/ STD delatch RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長:850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
| HFBR-5720ALP | 功能描述:光纖發(fā)射器、接收器、收發(fā)器 MM 2Gbps SFP BAIL WI RE DELATCH RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長:850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝: |
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