4
SC 25/WG3 Generic Cabling for
Customer Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecom-
munications Cabling Standard per
SP-2840.
Transmitter and Receiver
Signaling Rate Range and
BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to encode
the data (symbols/bit).
The specifications in this data
sheet have all been measured using
the standard Fibre Channel symbol
rate of 266 MBd.
The data link modules can be used
for other applications at signaling
rates different than specified in this
data sheet. Depending on the
actual signaling rate, there may be
some differences in optical power
budget. This is primarily caused by
a change in receiver sensitivity.
These data link modules can also
be used for applications which
require different bit-error-ratio
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the receiver
input optical power level.
Data Link Jitter
Performance
The Agilent 1300 nm data link
modules are designed to operate
per the system jitter allocations
stated in FC-PH Annex A.4.3 and
A.4.4.
The 1300 nm transmitter will
tolerate the worst-case input
electrical jitter allowed, without
violating the worst-case output
optical jitter requirements.
The 1300 nm receiver will tolerate
the worst-case input optical jitter
allowed without violating the
worst-case output electrical jitter
allowed.
The jitter specifications stated in
the following transmitter and
receiver specification tables are
derived from the values in FC-PH
Annex A.4.3 and A.4.4. They
represent the worst-case jitter
contribution that the transmitter
and receiver are allowed to make
to the overall system jitter without
violating the allowed allocation. In
practice, the typical jitter contribu-
tion of the Agilent data link
modules is well below the
maximum allowed amounts.
Recommended Handling
Precautions
It is advised that normal static pre-
cautions be taken in the handling
and assembly of these data link
modules to prevent damage which
may be induced by electrostatic
discharge (ESD). The HFBR-1119/
-2119 series meets MIL-STD-883C
Method 3015.4 Class 2.
Figure 5. HFBR-1119T/2119T Bit-
Error-Ratio vs. Relative Receiver
Input Optical Power.
Care should be taken to avoid
shorting the receiver Data or
Signal Detect Outputs directly to
ground without proper current-
limiting impedance.
Solder and Wash Process
Compatibility
The transmitter and receiver are
delivered with protective process
caps covering the individual ST*
ports. These process caps protect
the optical subassemblies during
wave solder and aqueous wash
processing and act as dust covers
during shipping.
These data link modules are
compatible with either industry
standard wave- or hand-solder
processes.
Shipping Container
The data link modules are
packaged in a shipping container
designed to protect it from
mechanical and ESD damage
during shipment or storage.
Board Layout–Interface
Circuit and Layout
Guidelines
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these data link modules.
Figure 6 provides a good example
of a power supply filter circuit that
works well with these parts. Also,
suggested signal terminations for
the Data, Data-bar, Signal Detect
and Signal Detect-bar lines are
shown. Use of a multilayer,
ground-plane printed circuit board
will provide good high-frequency
circuit performance with a low
inductance ground return path. See
additional recommendations noted
in the interface schematic shown in
Figure 6.
B
RELATIVE INPUT OPTICAL POWER – dB
1 x 10
-8
1 x 10
-9
1 x 10
-10
1 x 10
-11
-4
1 x 10
-2
-2
1 x 10
-12
1 x 10
-6
1 x 10
-7
-6
2
0
1 x 10
-5
1 x 10
-3
1 x 10
-4
CONDITIONS:
1. 266 MBd
2. PRBS 2
7
-1
3. T
A
= 25 °C
4. V
CC
= 5 Vdc
5. INPUT OPTICAL RISE/FALL TIMES =
1.0/1.9 ns
CENTER OF SYMBOL