參數(shù)資料
型號： HFBR-0573
英文描述： Evaluation Kit for GBIC Gigabit Ethernet or Fibre Channel Applications
中文描述： 評價GBIC千兆位以太網(wǎng)或光纖通道套件應用
文件頁數(shù)： 12/16頁
文件大?。?/td> 446K
代理商： HFBR-0573
5
Electromagnetic
Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard; and
more importantly, it reduces the
possibility of interference to
neighboring equipment. There are
three options available for the
HFBR-53D3 and two for the
HFCT-53D3 with regard to EMI
shielding which provide the
designer with a means to achieve
good EMI performance. The EMI
performance of an enclosure
using these transceivers is
dependent on the chassis design.
Agilent encourages using
standard RF suppression
practices and avoiding poorly
EMI-sealed enclosures.
The first configuration is a
standard HFBR-53D3 fiber optic
transceiver that has no external
EMI shield. This unit is for
applications where EMI is either
not an issue for the designer, the
unit resides completely inside a
shielded enclosure, or the module
is used in a low density,
extremely quiet application. The
HFCT-53D3 is not available for
use without an external shield.
The second configuration, option
EM, is for EMI shielding
applications where the position of
the transceiver module will
extend outside the equipment
enclosure. The metallized plastic
package and integral external
metal shield of the transceiver
helps locally to terminate EM
fields to the chassis to prevent
their emissions outside the
enclosure. This metal shield
contacts the panel or enclosure
on the inside of the aperture on
all but the bottom side of the
shield and provides a good RF
connection to the panel. This
option can accommodate various
panel or enclosure thickness, i.e.,
.04 in. min. to 0.10 in. max. The
reference plane for this panel
thickness variation is from the
front surface of the panel or
enclosure. The recommended
length for protruding the
HFBR/HFCT-53D3 EM
transceiver beyond the front
surface of the panel or enclosure
is 0.25 in. With this option, there
is flexibility of positioning the
module to fit the specific need of
the enclosure design. (See
Figure 6 for the mechanical
drawing dimensions of this
shield.)
The third configuration, option
FM, is for applications that are
designed to have a flush mounting
of the module with respect to the
front of the panel or enclosure.
The flush-mount design
accommodates a large variety of
panel thickness, i.e., 0.04 in. min.
to 0.10 in. max. Note the
reference plane for the flush-
mount design is the interior side
of the panel or enclosure. The
recommended distance from the
centerline of the transceiver front
solder posts to the inside wall of
the panel is 0.55 in. This option
contacts the inside panel or
enclosure wall on all four sides of
this metal shield. See Figure 8 for
the mechanical drawing
dimensions of this shield.
The two metallized designs are
comparable in their shielding
effectiveness. Both design
options connect only to the
equipment chassis and not to the
signal or logic ground of the
circuit board within the
equipment closure. The front
panel aperture dimensions are
recommended in Figures 7 and 9.
When layout of the printed circuit
board is done to incorporate
these metal-shielded transceivers,
keep the area on the printed
circuit board directly under the
metal shield free of any
components and circuit board
traces. For additional EMI
performance advantage, use
duplex SC fiber-optic connectors
that have low metal content
inside them. This lowers the
ability of the metal fiber-optic
connectors to couple EMI out
through the aperture of the panel
or enclosure.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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HFBR1100 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Optoelectronic
HFBR-1115T 功能描述:光纖發(fā)射器、接收器、收發(fā)器 1300nm 125MBd 16-pin DIP ST Tx RoHS:否 制造商:Omron Electronics 產(chǎn)品:Transmitters 數(shù)據(jù)速率:3.5 Gbps 波長:850 nm 最大工作溫度: 最小工作溫度: 封裝 / 箱體: 封裝:
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