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參數(shù)資料
| 型號： | HFA1130IB96 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 5/13頁 |
| 文件大小： | 0K |
| 描述： | IC BUFFER CFA 850MHZ 8-SOIC |
| 標準包裝： | 2,500 |
| 放大器類型： | 電流反饋 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 2300 V/µs |
| -3db帶寬： | 850MHz |
| 電流 - 輸入偏壓： | 25µA |
| 電壓 - 輸入偏移： | 2000µV |
| 電流 - 電源： | 21mA |
| 電流 - 輸出 / 通道： | 60mA |
| 電壓 - 電源，單路/雙路(±)： | ±4.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOIC |
| 包裝： | 帶卷 (TR) |
13
FN3369.5
April 25, 2013
HFA1130
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
TOP VIEW
INDEX
AREA
12
3
-C-
SEATING PLANE
x 45°
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
SIDE VIEW “A
SIDE VIEW “B”
1.27 (0.050)
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
0.50 (0.20)
0.25 (0.01)
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013)
8°
0°
0.25 (0.010)
0.19 (0.008)
1.27 (0.050)
0.40 (0.016)
1.27 (0.050)
5.20(0.205)
1
2
3
4
5
6
7
8
TYPICAL RECOMMENDED LAND PATTERN
2.20 (0.087)
0.60 (0.023)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| HFA1130IBZ | 功能描述:運算放大器 - 運放 W/ANL OPAMP 850MHZ CFB CLMP IND RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| HFA1130IBZ | 制造商:Intersil Corporation 功能描述:Operational Amplifier (Op-Amp) IC |
| HFA1130IBZ-T | 功能描述:運算放大器 - 運放 W/ANL OPAMP 850MHZ CFB CLMP IND RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| HFA1130IJ | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA1130IP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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