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參數(shù)資料
| 型號(hào)： | HFA1115IP |
| 廠商： | HARRIS SEMICONDUCTOR |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Mini-Stripax Plus Replacement Blade; Conductor Size AWG:24-22; Features:Includes top & bottom blades, spring & wire stop; Specially formed stripping blades ensure no damage to the conductor; Easy to install RoHS Compliant: Yes |
| 中文描述： | BUFFER AMPLIFIER, PDIP8 |
| 文件頁(yè)數(shù)： | 5/5頁(yè) |
| 文件大?。?/td> | 537K |
| 代理商： | HFA1115IP |
198
HFA1115/883
Spec Number
511109-883
Die Characteristics
DIE DIMENSIONS:
59 x 58.2 x 19 mils
±
1 mils
1500 x 1480 x 483
μ
m
±
25.4
μ
m
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8k
±
0.4k
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16k
±
0.8k
GLASSIVATION:
Type: Nitride
Thickness: 4k
±
0.5k
WORST CASE CURRENT DENSITY:
TBD
TRANSISTOR COUNT:
89
SUBSTRATE POTENTIAL (Powered Up):
Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1115/883
V-
OUT
+IN
-IN
V+
V
L
V
H
V-
V
L
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
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